High Barrier PA/PE/EVOH Composite Film for Electronic Packaging

High Barrier PA/PE/EVOH Composite Film Description

High-barrier PA/PE/EVOH composite film is a premium, multi-layer electronic packaging solution designed to deliver exceptional barrier protection, durability, and adaptability. Made from polyamide (PA), polyethylene (PE), and ethylene vinyl alcohol (EVOH), these advanced materials provide superior protection. These films combine the unique properties of each layer to create a robust, flexible, and highly effective barrier against environmental factors such as moisture, oxygen, and other gases, which are critical for safeguarding sensitive electronic components. 

High Barrier PA/PE/EVOH Composite Film Specifications

Structure of High Barrier PA/PE/EVOH Composite Film

PA (polyamide) layer:

This layer is strong, puncture-resistant and durable. It resists gases and offers flexibility and resistance to heat. It is often used as an outer layer to make structures stronger. 

PE (polyethylene) layer:

This layer acts as a sealant, ensuring seam sealing and compatibility, and preventing water vapor from penetrating the package, which is critical to protecting electronic components from corrosion or electrical failure.

EVOH (Ethylene Vinyl Alcohol) layer:

This layer has excellent oxygen barrier properties and is usually sandwiched between the PA layer and the PE layer to play a moisture-proof role.

Feature of High Barrier PA/PE/EVOH Composite Film

• High transparency for clear visibility of the product

  
  

• Excellent machinability for smooth and efficient processing

  
  

• High barrier performance to extend shelf life and preserve product quality

  
  

• Outstanding puncture resistance to ensure packaging integrity

High Barrier PA/PE/EVOH Composite Film Applications

Electronic components, IC chips, LED light strips, auto parts, and more.