High-Barrier PA/PE/Evoh Composite Film hi premium, multi-layer electronic packaging solution a ni a, hei hian barrier protection, durability, leh adaptability danglam tak a pe thei a ni. Polyamide (PA), polyethylene (PE), leh ethylene vinyl alcohol (EVOH) atanga siam, heng thil hmasawn tak takte hian venhimna tha zawk a pe a ni. Heng film-te hian layer tin property danglam tak takte chu an thlunzawm a, chu chuan environment factors, moisture, oxygen, leh gas dang, sensitive electronic components humhalhna atana pawimawh tak, environment factors te laka inkharkhip nghet, flexible leh effective tak a siam a ni.
HSQY 10 a ni.
Flexible packaging film te pawh a awm bawk.
Clear, tih dan .
A awm theihna: | |
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High Barrier PA/PE/Evoh Composite Film 2019. A rilru a hah lutuk a, a rilru a buai em em bawk.
High-Barrier PA/PE/Evoh Composite Film hi premium, multi-layer electronic packaging solution a ni a, hei hian barrier protection, durability, leh adaptability danglam tak a pe thei a ni. Polyamide (PA), polyethylene (PE), leh ethylene vinyl alcohol (EVOH) atanga siam, heng thil hmasawn tak takte hian venhimna tha zawk a pe a ni. Heng film-te hian layer tin property danglam tak takte chu an thlunzawm a, chu chuan environment factors, moisture, oxygen, leh gas dang, sensitive electronic components humhalhna atana pawimawh tak, environment factors te laka inkharkhip nghet, flexible leh effective tak a siam a ni.
Product item 1000 a ni. | High Barrier PA/PE/Evoh Composite Film 2019. A rilru a hah lutuk a, a rilru a buai em em bawk. |
Bungrua | PA/TIE/PP/TIE/PA/PA/PA/Pa/Tie/Pe/Pe/Pe |
Rawng | Clear, tih dan . |
Vang | 160mm-2600mm a ni a, a tha ber a ni. |
Thickness . | 0.045mm-0.35mm , tih dan tur a ni. |
Dilna | Electronic packaging a awm em? |
PA (Polyamide) Layer:
He layer hi a chak a, puncture-resistant a ni a, a chhe thei lo bawk. Gas a do thei a, flexibility leh heat laka inven theihna a pe bawk. Structure chak zawka siam turin pawn lam layer atan an hmang fo thin.
PE (Polyethylene) layer:
He layer hian sealant angin hna a thawk a, seam sealing leh compatibility a awm theih nan a enkawl a, tui vapor chu package chhungah a luh theih loh nan a veng bawk a, hei hi electronic components te chu corrosion emaw electrical failure emaw laka venna atan a pawimawh hle.
Evoh (ethylene vinyl alcohol) layer:
He layer hian oxygen barrier property tha tak a nei a, a tlangpuiin PA layer leh PE layer inkarah moisture-proof role play turin a sandwich thin.
Product hmuh theihna chiang tak neih theih nan transparency sang tak neih a ni.
Processing awlsam leh tha tak neih theihna turin machinability tha tak a nei
Shelf life tihzauh leh product quality humhalh nan high barrier performance .
Packaging integrity a awm theih nan outstanding puncture resistance .
Electronic components, IC chips, LED light strip, auto parts leh thil dang tam tak.
Content a awm lo!