Blak ESD Anti-Statik HIPS Sheet Rol fɔ Ilɛktronik Pakɛj
HSQY de saplae 0.2-1.8 mm blak ESD anti-statik HIPS shit ɛn rol fɔ thermoformed ilɛktronik pak. Dɛn mek am frɔm ay impak polistayn we dɛn modify wit polybutadiene, di matirial kɔba impak rɛsistɛns, dimɛnshɔnal stebiliti, rigiditi ɛn kɔntrol statik protɛkshɔn fɔ sɛnsitiv ilɛktronik kɔmpɔnɛnt dɛn we dɛn de prodyuz, handel, stɔrɔj ɛn transpɔt.
Di matirial fayn fɔ vaykum fɔm IC trey, PCB ɛn PCBA trey, sɛmikɔndɔkta kɔmpɔnɛnt kyaria, FPC trey, SMT pat trey, protɛktiv kɔva ɛn kɔstɔmayz ilɛktronik pak. Tiknes, wit, shit saiz, rol fɔmat, sɔfa finish, pak ɛn ESD pefɔmɛns kin kɔnfɔm akɔdin to di aplikeshɔn ɛn bay bay rikwaymɛnt.
Blak ESD HIPS sheet fɔ thermoformed ilɛktronik pak
![Sɛtifiket fɔ HSQY ESD HIPS sheet]()
Rilat kwaliti ɛn kɔmplians dɔkyumɛnt dɛn
Wetin Na ESD Anti-Statik HIPS Shit?
Wan ESD HIPS shit na wan ay impak polistayn shit we dɛn ɛnjinia fɔ ridyus statik chaj akyumyuleshɔn ɔ fɔ gi wan kɔntrol rod fɔ ilɛktrɔstatik chaj disipeshɔn. Standard HIPS de gi gud impak trɛnk ɛn thermoforming pefɔmɛns, we di ESD gred na fɔ pak ɛn handel aplikeshɔn dɛn we involv ilɛktrɔstatik-sɛnsitiv divays dɛn.
Di tεm dεm anti-statik, statik dissipativ εn kכnduktiv de dεskrεb difrεn lεvεl dεm fכ ilektrikal pεrformεns. Di wan dɛn we de bay fɔ spɛsifa di sɔfayz rɛsistɛns we dɛn nid, di we aw dɛn de tɛst, di savis ɛnvayrɔmɛnt ɛn if di ESD fɛnshɔn fɔ bi fɔ shɔt tɛm ɔ fɔ lɔng tɛm. Di fainal resistans valyu fɔ kɔnfyus pan di apruv matirial gred pas fɔ infɛr ɔl frɔm di prodak kɔlɔ ɔ nem.
ESD HIPS Sheet Spɛsifikeshɔn dɛn
| di prɔpati dɛn |
Ditiɛl dɛn bɔt |
| Di Nem fɔ Prodak |
Blak ESD anti-statik HIPS sheet |
| Tin dɛn |
High Impact Polystyrene (HIPS) we dɛn dɔn modify wit polibutadiɛn |
| Tik we i tik |
0,2-1,8 mm |
| Fɔm fɔ di Sapɔt |
Sheet ɔ rol we dɛn mek fɔ yusɛf |
| Kɔlɔ |
Blak |
| ESD Pɔfɔmɛnshɔn |
Anti-statik ESD gred; konfam di rikwayd surface resistance en test method bifo yu oda |
| Tik |
1,04-1,06 g/cm⊃3, ɛn di ɔda wan dɛn; |
| Tensile Strɔng we pɔsin kin gɛt |
15-30 MPa |
| Impekt Strɔng |
0,09-0,16 N/m |
| Strɔng fɔ Bɛnd |
29.4-50 MPa we de na di wɔl |
| Point we de mek pɔsin soft |
84-100°C na di ples |
| Mɛlt Indeks |
2-9 g/10 min |
| Tɛmral Difɔmeshɔn Tɛmpratura |
70-84°C na di ples |
| Di we aw dɛn de du di wok |
Vaykum fɔm, thermoforming, kɔt ɛn day kɔt |
| Aplikeshɔn dɛn |
IC trey, PCB ɛn PCBA trey, FPC trey, SMT kɔmpɔnɛnt pak, protɛktiv kɔva ɛn ilɛktronik kɔmpɔnɛnt kyaria |
| Dokumɛnt dɛn we De |
SGS, ISO 9001:2008 ɛn RoHS-rilayt dɔkyumɛnt dɛn lɛk aw dɛn rayt am na di prɔdak pej; kɔnfɔm di ɛksaktɔl ripɔt skɔp ɛn validiti fɔ di gred we dɛn ɔda |
| MOQ we gɛt fɔ du wit am |
500 kg |
| Di Tɛm dɛn fɔ Pe |
T/T, L/C, Wɛstɛn Yuniɔn ɛn PayPal |
| Di Tɛm dɛn fɔ Delivri |
EXW, FOB, CNF ɛn DDU |
| Lid Taym |
nכmal wan 7-15 de fכ 1-20,000 kg; negotiable fɔ big ɔda |
Di valyu dɛn we de na di list na tipik prodak data ɛn dɛn kin difrɛn wit tik, fɔmyulashɔn, ESD gred, kɔlɔ, prodakshɔn batch ɛn tɛst we. Kɔnfɛm di fayn spɛsifikɛshɔn ɛn tɛst ripɔt bifo yu yuz di matirial fɔ wan rɛgyulayt ɔ pefɔmɛns-kritikal aplikeshɔn.
Aw ESD HIPS De Protɛkt Ilɛktronik Kɔmpɔnɛnt dɛn
Ilɛktronik kɔmpɔnɛnt dɛn kin pwɛl bay ilɛktrɔstatik dischaj we dɛn de gɛda, pak, intanɛnt lɔjistik ɛn shipmɛnt. ESD HIPS pakej na fɔ ridyus chaj akyumyuleshɔn ɛn kɔntrol di muvmɛnt fɔ statik ilɛktrishɔn akɔdin to di pak sɔfays, ɛp fɔ protɛkt sɛnsitiv divays dɛn frɔm fɔdɔm wantɛm wantɛm ɔ layt damej.
Di tin fɔ pak di tin fɔ pik togɛda wit di trey dizayn, di we aw dɛn de grɔn, di we aw dɛn de handle, di kɔndishɔn fɔ di humiditi ɛn di ESD kɔntrol program. Fɔ aplikeshɔn dɛn we involv sɛmikɔndɔkta, intagreted sɔrkwit ɔ prɛsishɔn ilɛktronik asɛmbli, gi di target sɔfa rɛsistɛns ɛn aplikebul tɛst standad we yu de aks fɔ sampul ɔ kot.
Ki Ficha dɛn fɔ Blak ESD HIPS Sheet
Kontrol statik protɛkshɔn: Dɛn mek am fɔ ilɛktronik pak aplikeshɔn dɛn we nid anti-statik ɔ ESD-kɔntrol pefɔmɛns.
High impact resistance: Polybutadiene modifyeshɔn de impruv tafnɛs kɔmpia wit jenɛral-pɔpɔs polistayn ɛn ɛp trey dɛn fɔ bia wit hanlin ɛn transpɔt.
Thermoforming pefomans: I fayn fɔ vaykum fɔm ɛn thermoforming kɔstɔmayz trey, blista, kɔmpɔnɛnt kyaria ɛn protɛktiv pak.
Dimɛnshɔnal stebiliti: I de mentɛn di trey jɔyometri ɛn kɔmpɔnɛnt pɔkit dɛn we dɛn nid we di matirial gred ɛn fɔm kɔndishɔn dɛn mach kɔrɛkt wan.
Kastom shit ɛn rol saplai: Yu kin pik tik, saiz, wit ɛn pak fɔ difrɛn tɛmfɔmin mashin ɛn trey dizayn.
I fayn fɔ blak ESD pak: Dɛn kin yuz di blak apinans fɔ ilɛktronik kɔmpɔnɛnt trey ɛn industrial protɛktiv pak usay layt transmishɔn nɔ nid.
Tɛmofɔmin ɛn Prɔsesin Gaydlain
Blak ESD HIPS shit kin vaykum fɔm insay trey, klamshɛl, kyaria ɛn kɔstɔm protɛktiv kɔmpɔnɛnt dɛn. Fɔm tɛmpracha, ɔt tɛm, mold dizayn, drɔ rɛsɛshɔn, kol kɔndishɔn ɛn shit ɔriɛnteshɔn fɔ bi ɔptimayz fɔ di tiknɛs ɛn ilɛktrik gred we yu dɔn pik.
Di matirial kin bak fɔ kɔt, day kɔt, drɔ ɔ mek am fɔ protɛktiv kɔva ɛn sɛparatɔ. Bifo mas prodakshɔn, tɛst di shit pan di ikwipmɛnt we yu want ɛn chɛk di pɔkit difinishɔn, di wɔl-tiknɛs distribyushɔn, shrinkage, flatnɛs, impak pefɔmɛns ɛn sɔfays rɛsistɛns afta i fɔm.
Aplikeshɔn fɔ ESD HIPS Shit ɛn Rol
IC ɛn sɛmikɔndɔkta trey: Tɛmofɔm trey fɔ intagreted sɔrkwit, chip ɛn sɛmikɔndɔkta kɔmpɔnɛnt dɛn.
PCB ɛn PCBA pak: Handlin, stɔrɔj ɛn transpɔt tre fɔ print sɔrkwit bɔd ɛn asembled sɔrkwit bɔd.
FPC ɛn SMT kɔmpɔnɛnt trey: Kastɔmaiz pɔkit fɔ fleksibul print sɛrkyut, kɔnɛkta, kapasitɔ, rɛsistɔ, dayɔd ɛn ɔda prɛsishɔn pat dɛn.
Kɔnsuma ilɛktroniks pak: Protɛktiv trey ɛn insɛt fɔ sɛns, kamɛra mɔdyul, mobayl fon kɔmpɔnɛnt ɛn ilɛktronik sabasɛmbli.
Protektiv kɔva ɛn haus: Fabrik kɔva, divayda ɛn tɛmporari ɛnklɔzhɔ we dɛn kin yuz fɔ mek ilɛktroniks ɛn intanɛnt lɔjistik.
Riyuzable komponent kyaria: Durable thermoformed pakej fɔ ripit muvmɛnt bitwin prodakshɔn, tɛst, asɛmbli ɛn westɛm ɔpreshɔn, sɔbjɛkt to gred validɛshɔn.
Aw fɔ Spɛsifik di ESD Pɔfɔmɛnshɔn we dɛn nid
Nɔ spɛsifa wan ESD pak matirial nɔmɔ as 'anti-static.' Di ilɛktrik pefɔmɛns we dɛn nid dipen pan di sɛnsitiviti fɔ di kɔmpɔnɛnt, grɔnin sistɛm, trey dizayn, hanlin prɔses ɛn aplikebul ESD kɔntrol standad. Wan prokyumɛnt spɛsifikɛshɔn fɔ no di target sɔfays rɛsistɛns ɔ rɛsistiviti, tɛst we, tɛst vɔlɔt, kɔndishɔn ɛnvayrɔmɛnt ɛn akseptabl tolɛreshɔn.
Ilektrikal target: Rikwayd anti-statik, statik-dissipativ ɔ kɔnduktiv gred ɛn di ɛksaktɔ rɛsistɛns rɛnj.
ESD teknɔlɔji: Kɔnfɛm if di prɔjek nid fɔ gɛt matirial we dɛn dɔn chenj insay, matirial we dɛn kɔt di sɔfa ɔ ɔda kɔnstrɔkshɔn.
Di kɔndishɔn fɔ di savis: Tɛmpratura, humiditi, di savis layf we dɛn de op fɔ, di we aw dɛn de klin ɛn di nɔmba fɔ di saykl dɛn we dɛn de handle.
Fɔm validɛshɔn: Dɛn fɔ chɛk di rɛsistɛns ɛn mɛkanikal pefɔmɛns afta dɛn dɔn thermoforming bikɔs di sheet strɛch ɛn prɔsesin kɔndishɔn kin afɛkt di finish trey.
Dokumɛnt: Rikwest di rilevɛns tɛst ripɔt, matirial diklareshɔn ɛn kɔmplians dɔkyumɛnt fɔ di spɛshal prodakshɔn gred ɛn batch.
Kwaliti Kɔntrol ɛn Sampul Aprɔval
Kwaliti inspekshɔn kin inklud tik, waid, rol wet, sɔfays apinans, kɔlɔ kɔnsistɛns, flatnɛs, mɛkanikal pefɔmɛns ɛn ESD rɛsistɛns akɔdin to di kɔnfyus ɔda spɛsifikɛshɔn. Fɔ thermoforming projɛkt, aprɔval fɔ bi bays pan matirial frɔm di intended prodakshɔn gred pas wan visually similar standad HIPS sampul.
A4 samplε dεm de fכ prεliminεri evalueshכn. Fɔ wan prodakshɔn trayal, gi di thermoforming mashin tayp, mold dimɛnshɔn, fɔm dip, rikwayd trey strɔkchɔ ɛn target ilɛktrik pefɔmɛns so dat dɛn go pripia wan mɔ ripɔt sampul.
Pak ɛn Deliv
Sampul pak: A4-sayz sɛmpul dɛn we dɛn pak insay PP bag ɔ bɔks.
Shit ɛn rol pak: Na lɛk 30 kg fɔ wan bag ɔ rol, we dɛn rap wit PE film ɔ kraft pepa akɔdin to di kɔnfyus spɛsifikɛshɔn.
Palet pak: Na lɛk 500-2,000 kg fɔ wan plai wud palet, i dipen pan di dimɛnshɔn ɛn transpɔt we dɛn nid.
Kontena lod: Na lɛk 20 tan fɔ wan standad kɔntena, we de ɔnda di rol dimɛnshɔn, palet kɔnfigyushɔn ɛn shiping limit.
Dilivri tɛm: EXW, FOB, CNF ɛn DDU.
Lid tɛm: Nɔmal wan na 7-15 dez fɔ ɔda tin dɛn we go rich 20,000 kg; big big ɔda dɛn de schedul akɔdin to di kɔnfyus prodakshɔn plan.
Aw fɔ Aks fɔ Kɔt
Fɔ gɛt kɔrɛkt kot ɛn matirial rɛkɛmɔndeshɔn, gi di tik, waid, shit ɔ rol fɔmat we yu nid, rol wet, kɔlɔ, target sɔfays rɛsistɛns, tɛst we, aplikeshɔn, fɔm prɔses, mɔnt kwantiti, pak we yu nid ɛn di pɔt usay yu de go.
Rikwest wan ESD HIPS Sampul ɔ Kot
Kwɛstyɔn dɛn we Dɛn Kin Aks Bɔku tɛm
Wetin dɛn kin yuz blak ESD HIPS sheet fɔ?
Blak ESD HIPS shit na in dɛn kin yuz mɔ fɔ tɛmɔfɔm trey, kyaria, kɔva ɛn protɛktiv pak fɔ IC, sɛmikɔndɔkta, PCB, PCBA, FPC, SMT kɔmpɔnɛnt, sɛns ɛn ɔda ilɛktrɔstatik-sɛnsitiv ilɛktronik pat dɛn.
Wetin na di difrɛns bitwin standad HIPS ɛn ESD HIPS?
Standard HIPS de gi impak resistans ɛn thermoforming pefɔmɛns bɔt dɛn nɔ mek am fɔ kɔntrol statik ilɛktrishɔn. ESD HIPS inklud wan ESD-kɔntrol sistem we dɛn mek fɔ ridyus di chaj akyumyuleshɔn ɔ disipate chaj akɔdin to di ilɛktrik gred we dɛn dɔn spɛsifa.
Anti-statik HIPS na di sem wit kɔnduktiv HIPS?
Nɔ. Anti-statik, statik-dissipativ ɛn kɔnduktiv matirial dɛn de ripresent difrɛn ilɛktrik pefɔmɛns lɛvɛl dɛn. Di kɔrɛkt gred fɔ pik yuz wan difayn sɔfays rɛsistɛns rɛnj ɛn tɛst we fɔ di kɔmpɔnɛnt we dɛn want ɛn di hanlin prɔses.
Us surface resistance dis ESD HIPS sheet de gi?
Di sɔs prodak pej de aydentify di matirial as anti-statik ESD gred bɔt i nɔ de tɔk wan fiks rɛsistɛns rɛnj. Gi di valyu we dɛn nid ɛn di we aw dɛn de tɛst so dat HSQY go kɔnfɔm di rayt gred, sampul ɛn sɔpɔt ripɔt bifo dɛn prodyuz.
Yu tink se ESD HIPS sheet kin bi vaykum fɔm?
Yɛs. Di matirial na fɔ vaykum fɔm ɛn thermoforming ilɛktronik tre ɛn kɔmpɔnɛnt kyaria. wan fכm trayal dεn rεkomεnd fכ vεrifik poket difinishכn, di wכl tik, shrink, flat εn post-fכm ilektrikal pεrformεns.
Us tik tik dɛn de?
Di prodak de insay tiknes frɔm 0.2 mm to 1.8 mm akɔdin to di spɛsifikɛshɔn we dɛn gi. Kɔnfɔm di tiknɛs tolɛreshɔn we yu nid, di wit, di rol dayamita ɛn di rol wet we yu de aks fɔ kot.
Yu tink se yu kin mek di sheet saiz ɛn di rol waid we yu want?
Yɛs. HSQY kin saplae sheet ɔ rol fɔmat akɔdin to di intended thermoforming ikwipmɛnt, mold saiz ɛn pak aplikeshɔn. Minimum ɛn maksimal wit fɔ kɔnfyus fɔ di tik we dɛn dɔn pik ɛn di kwantiti we dɛn dɔn ɔda.
Yu tink se thermoforming de afɛkt di ESD pefɔmɛns?
I kin ebul. Di ɔt, strɛch, ridɔkshɔn pan di tik we di wɔl tik ɛn chenj di sɔfa kin afɛkt di rɛsistɛns we dɛn mɛzhɔ pan di trey we dɔn dɔn. So dɛn fɔ tɛst di ilɛktrik pefɔmɛns afta dɛn dɔn fɔm ɔnda di kɔndishɔn ɛn tɛst prosidur we dɛn gri pan.
Yu tink se sampul dɛn de fɔ tɛst?
Yɛs. Fri A4 sɛmpul dɛn de fɔ di fɔs ɛvalueshɔn, wit kɔriɔ freyt we di pɔsin we bay kin pe nɔmal wan. Wan prodakshɔn-grɛd trayal sampul de rɛkɔmɛnd we rɛsistɛns, tɛmfɔmin dip ɔ dimɛnshɔnal tolɛreshɔn impɔtant.
Us infɔmeshɔn dɛn nid fɔ gɛt ESD HIPS kot?
Gi di tik, wit, shit ɔ rol fɔmat, target sɔfays rɛsistɛns, tɛst we, fɔm aplikeshɔn, trey dimɛnshɔn, ɔda kwantiti, pak rikwaymɛnt ɛn dɛstineshɔn pɔt. Dis infɔmeshɔn de alaw HSQY fɔ rikomɛnd wan gred we fit ɛn pripia wan kot we kɔrɛkt mɔ.
Bɔt HSQY Plastik Grup
Changzhou Huisu Qinye Plastic Group Co., Ltd. de saplae plastic sheet, film ɛn thermoforming matirial fɔ pak, ilɛktroniks ɛn industrial aplikeshɔn dɛn. Di prodakt rεnj inklud HIPS shit, PVC film, PET matirial, plastic trey ɛn polycarbonate prodak.
HSQY de sɔpɔt B2B kɔstɔma dɛn wit spɛsifikɛshɔn sɛlɛkshɔn, sampul ɛvalueshɔn, kɔstɔmayz shit ɛn rol prodakshɔn, kwaliti inspekshɔn, ɛkspɔt pak ɛn intanashɔnal delivri. Kɔntakt di sɛl tim wit di target ESD pefɔmɛns ɛn thermoforming rikwaymɛnt fɔ gɛt matirial rɛkɔmɛndishɔn ɛn kot.
Kontakt HSQY fɔ ESD HIPS Sheet
