Electronic Packaging atana hman tur ESD Anti-Static HIPS Sheet Roll dum
HSQY hian thermoformed electronic packaging atan 0.2-1.8 mm black ESD anti-static HIPS sheet leh roll a supply a ni. High impact polystyrene polybutadiene hmanga siam danglam a ni a, he material hian impact resistance, dimensional stability, rigidity leh controlled static protection te a thlunzawm a, hei hian electronic component sensitive tak tak siam, handling, storage leh transportation-ah te a hmang thei a ni.
He material hi vacuum forming IC tray, PCB leh PCBA tray, semiconductor component carrier, FPC tray, SMT parts tray, protective cover leh customized electronic packaging atan a tha hle. Thickness, width, sheet size, roll format, surface finish, packaging leh ESD performance te chu application leh purchasing mamawh angin a finfiah theih a ni.
Thermoformed electronic packaging atana hman tur ESD HIPS sheet dum
![HSQY ESD HIPS sheet-a certificate neih theihna tur]()
Quality leh compliance documents nena inzawm te
ESD Anti-Static HIPS Sheet hi eng nge ni?
ESD HIPS sheet hi high impact polystyrene sheet a ni a, static charge accumulation tihtlem emaw electrostatic charge dissipation atana controlled path siam emaw tura engineer a ni. Standard HIPS hian impact strength tha tak leh thermoforming performance tha tak a pe a, ESD grade hi electrostatic-sensitive devices hmanga packaging leh handling application atana siam a ni thung.
Anti-static, static dissipative leh conductive tih hian electrical performance level hrang hrang a sawifiah a. Buyers te chuan surface resistance mamawh te, test dan te, service environment te leh ESD function hi hun eng emaw chen atan nge hun rei tak chhung atan a nih tur tih te an tarlang tur a ni. Final resistance value chu product rawng emaw hming emaw chauh atanga infer ai chuan approved material grade-ah confirm tur a ni.
ESD HIPS Sheet-a thil awm dan tur
| Property |
chungchang chipchiar takin |
| Product Hming |
A rilru a buai em em a, a rilru a hah em em bawk a. ESD Anti-Static HIPS Sheet |
| Bungrua |
High Impact Polystyrene (HIPS) chu polybutadiene hmanga siam danglam a ni |
| Thickness a ni |
0.2-1.8 mm inkar a ni |
| Supply Form siam tur a ni |
Customized sheet emaw roll emaw a awm thei |
| Rawng |
Dum |
| ESD hnathawh dan |
Anti-static ESD grade a awm a; order hmain surface resistance leh test method mamawh chu confirm hmasa phawt ang che |
| Sakhal zawng |
1.04-1.06 g/cm⊃3 a ni a; |
| Tensile chakna a nei |
15-30 MPa thleng a ni |
| Impact chakna |
0.09-0.16 N/m a ni |
| Bending chakna |
29.4-50 MPa a ni |
| Softening Point a ni |
84-100°C thleng a ni |
| Melt Index a ni |
2-9 g/10 min a ni |
| A rilru a buai em em a, a rilru a hah em em bawk a |
70-84°C thleng a ni |
| Processing tih dan tur |
Vacuum siam, thermoforming, cut leh die cutting te a awm bawk |
| Dilna hrang hrang |
IC tray, PCB leh PCBA tray, FPC tray, SMT component packaging, venhimna khuhna leh electronic component carrier te a awm bawk |
| Document awmsa te |
SGS, ISO 9001:2008 leh RoHS nena inzawm document te chu product page-a tarlan angin; report scope dik tak leh ordered grade atana validity dik tak chu nemnghet rawh |
| MOQ |
500 kg a ni |
| Pawisa pek dan tur |
T/T, L/C, Western Union leh PayPal te a ni |
| Delivery dan tur |
EXW, FOB, CNF leh DDU te a ni |
| Lead Time a ni |
A tlangpuiin ni 7-15 chhungin kg 1-20,000 vel; order lian zawk tan pawh inrem theih a ni |
Listed value te hi typical product data a ni a, thickness, formulation, ESD grade, color, production batch leh test method hrang hrangah a danglam thei. Regulated emaw performance-critical application atana material hman hmain final specification leh test report chu confirm hmasa phawt ang che.
ESD HIPS hian Electronic Components a humhim dan
Electronic component te hi assembly, packaging, internal logistics leh shipment neih laiin electrostatic discharge vangin a chhe thei a ni. ESD HIPS packaging hi charge accumulation tihtlem nan leh packaging surface-a static electricity kal dan control nan siam a ni a, hei hian sensitive devices te chu a chhiat nghal emaw, latent damage emaw atanga venhimna atan a pui a ni.
Packaging material chu tray design, grounding method, handling process, humidity conditions leh ESD control program te nen thlan tur a ni. Semiconductors, integrated circuit emaw precision electronic assembly hmanga hman tur atan chuan sample emaw quotation emaw dil hunah target surface resistance leh test standard hman tur pe rawh.
Black ESD HIPS Sheet-a thil pawimawh ber berte
Controlled static protection: Electronic packaging application atana siam a ni a, anti-static emaw ESD-control performance mamawh a ni.
High impact resistance: Polybutadiene modification hian general-purpose polystyrene nena khaikhin chuan toughness a ti tha a, tray te chu handling leh transportation tuar thei turin a pui bawk.
Thermoforming performance: Vacuum siam leh thermoforming customized tray, blister, component carrier leh protective packaging atan a tha.
Dimensional stability: Material grade leh forming condition dik taka a inmil chuan tray geometry leh component pocket mamawh chu a vawng reng thin.
Custom sheet leh roll supply: Thermoforming machine hrang hrang leh tray design hrang hrang atan a thickness, size, width leh packaging thlan theih a ni.
Black ESD packaging atan a tha: Black appearance hi electronic component tray leh industrial protective packaging atan light transmission mamawh lohna hmunah hman a ni tlangpui.
Thermoforming leh Processing chungchanga kaihhruaina
Black ESD HIPS sheet hi vacuum hmangin tray, clamshell, carrier leh custom protective components-ah siam theih a ni. Forming temperature, heating time, mould design, draw ratio, cooling condition leh sheet orientation te chu thickness leh electrical grade thlan ang zela siam that tur a ni.
Material hi cut, die cut, drill emaw fabricated emaw pawh a ni thei a, chu chu protective cover leh separator atan hman theih a ni. Mass production hmain sheet chu hmanraw tumnaah test la, pocket definition, wall-thickness distribution, shrinkage, flatness, impact performance leh a siam hnua surface resistance te chu verify rawh.
ESD HIPS Sheet leh Roll hman dan tur
IC leh semiconductor tray: Integrated circuit, chip leh semiconductor component hrang hranga hman tur thermoformed tray.
PCB leh PCBA packaging: Printed circuit board leh assembled circuit board-a hman tur tray enkawl, dahkhawm leh phurh chhuahna.
FPC leh SMT component tray: Flexible printed circuit, connector, capacitor, resistor, diode leh precision part dangte tana pocket siam a ni.
Consumer electronics packaging: Sensor, camera module, mobile phone component leh electronic subassembly te tana venhimna tray leh insert te.
Protective cover leh housing: Electronics siamna leh internal logistics-a hman tur fabricated cover, divider leh temporary enclosure te.
Reusable component carrier: Production, testing, assembly leh warehouse hnathawhna inkara inthlak leh theihna tur thermoformed packaging chhe thei lo, grade validation neih a ngai.
ESD Performance mamawh tur tarlan dan
ESD packaging material chu 'anti-static.' tiin chauh tarlang suh. Electrical performance mamawh chu component sensitivity, grounding system, tray design, handling process leh ESD control standard hman tur ah a innghat a ni. Procurement specification-ah chuan target surface resistance emaw resistivity emaw, test method, test voltage, conditioning environment leh acceptable tolerance te a tarlang tur a ni.
Electrical target: Anti-static, static-dissipative emaw conductive grade mamawh leh resistance range dik tak.
ESD technology: Project-ah hian a chhunga siam danglam, a chunglam khuh thil emaw, sakna dang emaw a mamawh em tih finfiah.
Service dinhmun: Temperature, humidity, service life beisei, tihfai dan leh handling cycle zat.
Forming validation: Thermoforming hnuah resistance leh mechanical performance enfiah tur a ni a, a chhan chu sheet stretching leh processing condition hian tray siam zawh tawh chu a nghawng thei a ni.
Documentation: Production grade leh batch bik atana test report, material declaration leh compliance documents kaihhnawih dil tur.
Quality Control leh Sample pawmpuina pek a ni
Quality inspection-ah hian confirmed order specification angin thickness, width, roll weight, surface appearance, color consistency, flatness, mechanical performance leh ESD resistance te a tel thei a ni. Thermoforming project atan chuan approval hi visually similar standard HIPS sample aiin intended production grade atanga material atanga lak chhuah a ni tur a ni.
A4 sample hi preliminary evaluation neih theih a ni. Production trial atan chuan thermoforming machine chi, mold dimension, forming depth, tray structure mamawh leh target electrical performance te pe la, chutiang chuan sample aiawh zawk siam theih a ni.
Packing leh Delivery te pawh a awm bawk
Sample packaging: A4-size sample PP bag emaw box emaw-a dah.
Sheet leh roll packaging: Bag emaw roll khatah kg 30 vel, confirmed specification angin PE film emaw kraft paper emaw hmanga khuh.
Pallet packaging: Plywood pallet khatah kg 500-2,000 vel a ni a, chu chu a dimension leh transport mamawh a zirin a ni.
Container loading: Standard container khatah ton 20 vel, roll dimension, pallet configuration leh shipping limits te a innghat.
Delivery terms: EXW, FOB, CNF leh DDU te a ni.
Lead time: A tlangpuiin ni 7-15 chhung order kg 20,000 thleng; order lian zawk chu confirmed production plan angin schedule a ni.
Quote Dil Dan
Quotation dik tak leh material recommendation dawng tur chuan a mamawh thickness, width, sheet emaw roll format, roll weight, color, target surface resistance, test method, application, forming process, thla tin quantity, packaging mamawh leh destination port te pe tur a ni.
ESD HIPS Sample emaw Quote emaw dil rawh
Zawhna Zawh fo thin
Black ESD HIPS sheet hi eng atan nge hman?
Black ESD HIPS sheet hi IC, semiconductor, PCB, PCBA, FPC, SMT component, sensor leh electrostatic-sensitive electronic part dangte tana tray, carrier, cover leh protective packaging thermoform nan hman a ni ber.
Standard HIPS leh ESD HIPS hi eng nge an danglamna?
Standard HIPS hian impact resistance leh thermoforming performance a pe a, mahse static electricity control turin siam a ni lo. ESD HIPS hian electrical grade tarlan angin charge khawlkhawm tihtlem emaw, charge tihbo emaw tumna ESD-control system a huam a ni.
Anti-static HIPS leh conductive HIPS hi a inang em?
No. Anti-static, static-dissipative leh conductive material te hian electrical performance level hrang hrang a entir a. Grade dik tak chu surface resistance range ruat sa leh component ruahman leh handling process atana test method hmanga thlan tur a ni.
He ESD HIPS sheet hian eng surface resistance nge a pek?
Source product page hian material chu anti-static ESD grade a nih thu a tarlang a, mahse fixed resistance range pakhat mah a tarlang lo. HSQY-in a siam hmain grade, sample leh supporting report dik tak a nemnghet theih nan a mamawh value leh test method pe rawh.
ESD HIPS sheet hi vacuum hmanga siam theih a ni em?
Awle. He material hi electronic tray leh component carrier te vacuum siam leh thermoforming atana siam a ni. Pocket definition, wall thickness, shrinkage, flatness leh post-forming electrical performance te finfiah nan forming trial neih a tha.
Eng thickness nge awm?
He product hi supplied specification angin 0.2 mm atanga 1.8 mm thlenga thickness a awm a ni. Quotation dil hunah thickness tolerance, width, roll diameter leh roll weight mamawh te chu confirm rawh.
Sheet size leh roll width hi a duh angin a siam theih em?
Awle. HSQY hian thermoforming hmanrua, mold size leh packaging application angin sheet emaw roll format emaw a supply thei a ni. Thickness thlan chhuah leh order quantity atan minimum leh maximum widths confirm tur a ni.
Thermoforming hian ESD performance a nghawng em?
A ti thei. Heating, stretching, wall-thickness tihtlem leh surface inthlak danglamna hian tray siam zawh tawha resistance tehna a nghawng thei a ni. Chuvangin electrical performance chu forming hnuah conditioning leh test procedure inremna angin test tur a ni.
Sample test tur a awm em?
Awle. Free A4 sample hi initial evaluation atan a awm a, courier freight hi a tlangpuiin a lei tuin a pe thin. Resistance, thermoforming depth emaw dimensional tolerance emaw a pawimawh hunah production-grade trial sample hman a tha.
ESD HIPS quotation atan hian eng information nge mamawh?
Thickness, width, sheet emaw roll format, target surface resistance, test dan, forming application, tray dimension, order quantity, packaging mamawh leh destination port te pe rawh. He information hian HSQY chu grade tling tak recommend turin a phalsak a, quotation dik zawk a buatsaih thei bawk.
HSQY Plastic Group chungchang
Changzhou Huisu Qinye Plastic Group Co., Ltd. hian plastic sheet, film leh thermoforming materials te chu packaging, electronics leh industrial application atan a supply thin a ni. Product range-ah hian HIPS sheet, PVC film, PET material, plastic tray leh polycarbonate product te a tel a ni.
HSQY hian B2B customer te chu specification thlan, sample evaluation, customized sheet leh roll production, quality inspection, export packaging leh international delivery te a pui a ni. Material recommendation leh quotation dawng turin target ESD performance leh thermoforming mamawh te nen sales team te biak theih a ni.
ESD HIPS Sheet atan HSQY zawhfiah theih a ni
