HSQY we de wok
Polistayn Sheet we dɛn kin yuz
Wait, Blak, Kɔlɔ, Kastɔmayz
0.2 - 6mm, Na di wan we yu want
| Di tin dɛn we yu kin gɛt: | |
|---|---|
Polistayn Sheet we dɛn kin yuz
HSQY HIPS polistayn sheet matirial de kam togɛda ilɛktrik insuleshɔn, impak rɛsistɛns, rigiditi ɛn izi tɛmfɔmin fɔ pak, ikwipmɛnt kɔva, displei, aplayans pat ɛn industrial fabrikeshɔn.
High Impact Polystyrene, we dɛn kin kɔl HIPS , na rɔba-modified polystyrene matirial we dɛn mek fɔ gi big tafnɛs pas standad GPPS we i de kip gud rigiditi, thermoforming pefɔmɛns, printabiliti ɛn izi fɔ mek.
HSQY naw de saplae HIPS ɛn PS sheet matirial s frɔm lɛk 0.2mm to 6mm tik, wit wit we go rich 1600mm ɛn wayt, blak ɔ kɔstɔmayz kɔlɔ fɔ pak, sayn, aplayans, industrial ɛn ilɛktrik-insuleshɔn aplikeshɔn.
HIPS Polistayn Shit
Wait HI PS shit
Kastom HI PS shit
| Prɔpati | Spɛsifikeshɔn |
|---|---|
| Sɔntin | High Impact Polistayn Shit / HI PS shit |
| Tin dɛn | Polistayn ( PS ), Ay Impekt Polistayn ( HIPS ) |
| Tik we i tik | 0.2mm - 6mm, we yu kin kɔstɔmayz |
| Maksimal Width we pɔsin kin gɛt | I kin rich lɛk 1600mm |
| Kɔlɔ | Wayt, Blak, Kɔlɔ dɛn we dɛn dɔn kɔstɔmayz |
| Sho | Smɔl, glos, mat ɔ aplikeshɔn-spɛsifi k finish we de ɔnda gred kɔnfɔmeshɔn |
| Di we aw dɛn de du di wok | Tɛmofɔmin, vaykum fɔm, kɔt, CNC mashin, day kɔt, drɔlin, printin, peint ɛn laminating dipen pan gred |
| Ilektrikal Prɔpati | Base HIPS na ilɛktrik insuleshɔn; spɛsifa di dayelɛktrik ɔ ilɛktrik tɛst valyu dɛn we dɛn nid usay i impɔtant |
| Tipik Aplikeshɔn dɛn | Pakɛj trey dɛn , ilɛktrik insuleshɔn panɛl, ikwipmɛnt kɔva, sayn, displei, aplayans kɔmpɔnɛnt, ɔtomotiv intɛriɔ pat ɛn industrial fabrikeshɔn |
| Dokumɛnt dɛn we dɛn rayt | Kɔrɛnt sɔs rɛfrɛns SGS ɛn ISO 9001:2008; aks fɔ kɔrɛnt aplikebul dɔkyumentri fɔ di ɛksaktɔl prodak |
| MOQ we gɛt fɔ du wit am | 1000kg na wan |
| Di Tɛm dɛn fɔ Pe | 30% dipɔsit, 70% balans bifo shipmɛnt |
| Di Tɛm dɛn fɔ Delivri | FOB, CIF, EXW, ɛn ɔda pipul dɛn |
| Rifrɛns Lid Taym | 7-15 dez afta dipɔsit, sɔbjɛkt to spesifikeshɔn ɛn ɔda kwantiti |
Impɔtant: Dis prodak na sɔlid HIPS / PS sheet matirial ɛn i nɔ fɔ kɔnfyus wit E PS ɔ XPS fom insuleshɔn bɔd. I kin gi ilɛktrik insuleshɔn, bɔt dɛn nɔ tɔk ɛni tɛmal kɔnduktiviti, R-valyu ɔ bildin-insuleshɔn rɛytin fɔ dis prɔdak.
HIPS tinap fɔ Ay Impɛkt Polistayn. I de prodyuz bay we dɛn de modify polistayn wit rɔba faz fɔ mek i taf ɛn nɔ krak we yu kɔmpia am wit standad Jɛnɛral Pɔpɔz Polistayn.
HIPS de kam togɛda yusful rigiditi wit izi thermoforming ɛn fabrication, we mek i fayn fɔ ay-volyum pak trey dɛn , aplayans layna, print displei, industrial kɔva, sayn ɛn ɔda kɔnvɔyt kɔmpɔnɛnt dɛn.
Standard HIPS na nɔmal wan opɛk pas fɔ bi ayli transparent. Wait ɛn blak na kɔmɔn prodakshɔn kɔlɔ dɛn, we yu kin pik kɔstɔm kɔlɔ dɛn akɔdin to wetin di prɔjek nid ɛn di kwantiti we dɛn ɔda.
Polistayn na ilɛktrik insuleshɔn tɛmplastik, we de alaw fɔ tink bɔt HIPS sheet matirial fɔ nɔ-kɔnduktiv barɛri, kɔva, sɛparatɔ ɛn fabrik kɔmpɔnɛnt dɛn insay fayn ilɛktrik ɛn industrial aplikeshɔn dɛn.
Bɔt dɛn nɔ fɔ sho di ilɛktrik insuleshɔn bay di matirial nem nɔmɔ. If wan prɔjek nid fɔ gɛt difayn dayelɛktrik trɛnk, volyum rɛsistiviti, sɔfayz rɛsistiviti, insuleshɔn rɛsistɛns ɔ ɔpreshɔn vɔlɔt, gi di valyu ɛn tɛst we dɛn nid bifo yu ɔda.
| Ilɛktrik Rikwaymɛnt | Infɔmeshɔn fɔ Kɔnfɔm |
|---|---|
| Dielektrik Strɔng | Rikwayd tɛst valyu, tɛst mɛtɔd ɛn sheet matirial tiknɛs |
| Volyum Resistiviti fɔ di wan dɛn we de wok | Target valyu ɛn mɛzhɔmɛnt standad usay dɛn nid am |
| Surface Resistiviti fɔ di wɔl | Spɛsifik we di statik-kɔntrol bihayvya impɔtant |
| Tɛmpratura we dɛn de yuz fɔ wok | Kɔntinyu ɛn pik tɛmpracha we dɛn de ɛkspɛkt insay di kɔmpɔnɛnt we dɔn dɔn |
| Di we aw pɔsin kin bɔn | Rikwayd flammabiliti standad ɛn prodak tiknɛs if i apɔynt |
Sɔlid HIPS sheet matirial gɛt difrɛn prɔpati ɛn aplikeshɔn frɔm ɛkspanda polisitayn (E PS ) ɛn ɛkstruded polistayn ( XPS ) fom insuleshɔn bɔd dɛn.
E PS εn XPS gεt wan sεlyul fכm strכkchכ εn dεn kin kכmכn fכ sεlekt fכ bil tεmכl insulεshכn. HSQY in 0.2-6mm HIPS sheet matirial na wan sɔlid tɛmplastik prodak we dɛn mek mɔ fɔ thermoforming, pak, printin, fabricated panɛl ɛn ilɛktrik-insuleshɔn aplikeshɔn.
If yu projɛkt nid fɔ gɛt difayn tɛmal kɔnduktiviti ɔ R-valyu, gi di target rikwaymɛnt so dat dɛn go pik di aprɔpriet insuleshɔn matirial pas fɔ tek am se wan sɔlid HIPS sheet matirial ikwal to wan E PS ɔ XPS fom bɔd.
| Ficha | HI PS shit | E PS / XPS Fɔm Bɔd |
|---|---|---|
| Bildin | Sɔlid tɛmplastik sheet matirial | Sεlyul fכm strכkchכ |
| Men Pɔpɔshɔn | Tɛmofɔmin, pak, printin, fabrikeshɔn ɛn ilɛktrik insuleshɔn | Bil ɛn kɔnstrɔkshɔn tɛmal insuleshɔn |
| Tipik Tiknɛs | HSQY naw prodakt: aprɔksimatli 0.2-6mm | Usually substantially tik dipen pan insuleshɔn sistem |
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Major HIPS we fɔ prosɛs | Nɔ pik am as kɔvɛnshɔnal tɛmfɔmin sheet matirial |
| Insuleshɔn fɔ Tɛmral | No R-valyu ɔ tɛmal kɔnduktiviti nɔ spɛsifa fɔ dis HSQY prodak | Praymari prodakt wok |
Impruv impak resistans: Rɔba modifyeshɔn de gi big tafnɛs pas standad GPPS .
Gud thermoformability: Dɛn kin fɔm fayn gred dɛn wit vaykum ɛn thermoformed insay trey dɛn , kɔva, layna ɛn haus.
Laytwɛt: HIPS de gi yusful stiffnɛs ɛn tafnɛs we nɔ gɛt bɔku kɔmpɔnɛnt wet.
Ilektrikal insuleshɔn: Stɛndad HIPS na ilɛktrik insuleshɔn, we de ɔnda aplikeshɔn-spɛsifi k ilɛktrik validɛshɔn.
I izi fɔ mek: HIPS kin kɔt, drɔ, rout, day-kɔt, mashin ɛn bon yuz fayn fayn we fɔ mek.
Printable surface: Suitabl HIPS surfaces kin sɔpɔt skrin, dijital ɛn ɔda printin prɔses afta kɔmpatibiliti tɛst.
Kastom kɔlɔ: Dɛn kin tɔk bɔt wayt, blak ɛn kɔstɔmayt kɔlɔ dɛn akɔdin to di ɔda tin dɛn we dɛn nid.
Kɔst-ɛfɛktiv prɔsesin: HIPS na tin we dɛn kin pik fɔ ay-volyum fɔm ɛn fabrik aplikeshɔn dɛn we nid fɔ gɛt ikɔnomik tɛmplastik sheet matirial .
Tεmכfכm na wan pan di praymar yus dεm fכ HIPS sheet matirial . Dɛn kin ɔt di matirial te i pliable inof ɛn afta dat dɛn kin fɔm am agens wan mold we dɛn de yuz vaykum, prɛshɔn ɔ mɛkanikal ɛp.
HIPS na fɔm trey dɛn , insɛt, aplayans kɔmpɔnɛnt, ikwipmɛnt kɔva, displei pat ɛn industrial haus bikɔs fayn gred dɛn de gi yusful balans fɔ fɔmabiliti ɛn impak rɛsistɛns.
| Thermoforming Factor | Wetin fɔ Evaluet |
|---|---|
| Start Tiknɛs | Gej we yu nid bifo yu strɛch |
| Fɔm Dip | Dip drɔ kin ridyus di lokal wɔl tik |
| Mold Jɛometri | Radius, cavity dip ɛn ditel de afɛkt matirial distribyushɔn |
| Fɔ mek di ples wam | Yunifɔm ɔt de sɔpɔt mɔ kɔnsistɛns fɔm |
| Faynal Tiknɛs fɔ di Wɔl | Mezhɔ krichɔl eria dɛn pan di finish fɔm kɔmpɔnɛnt |
| Impekt Pɔfɔmɛnshɔn | Kɔnfɛm pan di las pat we dɛn dɔn fɔm usay mɛkanikal pefɔmɛns impɔtant |
Tin HIPS sheet matirial kin tεmכfכm insay prכtektiv trey dɛn , insεt, klamshεl-stayl kכmכpכnεnt dεm, industrial pak εn כda fכm pak strכkchכ dεm.
Di wan dɛn we de bay pak fɔ spɛsifa di fɔm dip, rigiditi we dɛn nid, impak rɛsistɛns, kɔlɔ, stak dizayn ɛn di pak-prɔdak we dɛn nid. If dɛn gɛt fɔ du wit it, mɛrɛsin, famasi ɔ ilɛktronik pak, sho di tin dɛn we yu nid ɛn di dɔkyumɛnt dɛn we yu nid bifo yu pik wan gred.
HIPS na tin we dɛn kin yuz fɔ rital sayn, POP displei, prɔmoshɔnal panɛl ɛn print kɔmpɔnɛnt dɛn bikɔs i kin jɔyn wan smol say we dɛn kin print wit lɔw wet, rigiditi ɛn izi fɔ mek.
Print pefomans dipen pan surface finish, surface enaji, ink kemistri en curing method. If wan prɔjek nid fɔ gɛt korona tritmɛnt ɔ wan difayn dayn lɛvɛl, put da rikwaymɛnt de insay di spɛsifikɛshɔn fɔ bay.
HIPS kin evalyu fɔ frij layna, aplayans haus, kɔva, intɛriɔ panɛl ɛn ɔda fɔm ɔ fabricated kɔmpɔnɛnt dɛn usay impak rɛsistɛns, rigiditi, sɔfayz apinɛns ɛn tɛmfɔmin pefɔmɛns nid fɔ.
Fɔ aplayans ɔ industrial prɔjek, di wan dɛn we de bay fɔ spɛsifa di opareshɔn tɛmpracha, kemikal ɔ ditajɛn ɛksplɔshɔn, kɔlɔ, glos, fɔm dip, impak rikwaymɛnt ɛn ɛni aplikebul prodak standad.
Dɛn kin tink bɔt sɔm HIPS gred dɛn fɔ intɛriɔ trim, protɛktiv kɔva ɛn fɔm kɔmpɔnɛnt usay ikɔmik tɛmfɔmin ɛn mɔdaret impak pefɔmɛns nid fɔ de.
Otomotiv projɛkt dɛn fɔ difayn ɔt rɛsistɛns, impak pefɔmɛns, ɔda, ɛmishin, sɔfayz apinɛns ɛn ɛni OEM-spɛsifi k rikwaymɛnt pas fɔ tek am se wan jenɛral HIPS gred na ɔtomɛtik fit.
| Ficha | HIPS | GPPS |
|---|---|---|
| Tin dɛn | Polistayn we dɛn dɔn chenj wit rɔba | Jɛnɛral Pɔpɔshɔn Polistayn |
| Di Tipik Apɛndiks | Bɔku tɛm, i nɔ kin shayn; kɔmɔn fɔ wayt, blak ɔ kɔlɔ | Kɔmɔn fɔ klia ɛn glos |
| Impekt Resistans fɔ mek yu nɔ gɛt ɛnitin fɔ du wit am | Higher bikɔs ɔf rɔba modifyeshɔn | Rigid bɔt we yu kɔmpia am wit brittle |
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Dɛn kin pik am fɔ pat dɛn we gɛt tɛmmofɔm | I fayn fɔ di prɔdak dɛn we dɛn dɔn pik klia fɔm |
| Di men tin we yu fɔ pik fɔ du | Tafnɛs, fɔm ɛn printin | Transparency, glos ɛn rigiditi |
Fɔ transparent polistayn aplikeshɔn, ɛksplɔrɔ wi PS shit rɛnj ɛn kɔnfɔm if GPPS ɔ HIPS fit mɔ fɔ di prɔjek.
HIPS kin prosɛs yuz kɔmɔn plastic- sheet matirial fabrikeshɔn we dɛn yuz fayn tul, spid ɛn prɔses kɔndishɔn.
| Proses | Tipik Yuz |
|---|---|
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Trey, layna, haus ɛn tri-dimɛnshɔnal pat dɛn |
| Fɔm we dɛn de mek wit vaykum | Packaging, aplayans komponent ɛn kɔva dɛn |
| CNC Cutting we dɛn de kɔt | Kastom panɛl, kɔva ɛn pat dɛn we dɛn mek |
| Day Kɔt / Panch | High-volume flat komponent ɛn pak pat dɛn |
| Fɔ drɔl | Mounting hol ɛn fabricated asɛmbli dɛn |
| Fɔ print | Sayn dɛn, grafik dɛn, displei dɛn ɛn panɛl dɛn we gɛt brand |
| Laminɛshɔn we dɛn kin yuz | Dekorativ ɔ funkshɔnal multilayer kɔmpɔnɛnt dɛn we de ɔnda adhesive kɔmpatibiliti |
| Rikwaymɛnt | Infɔmeshɔn fɔ Gi |
|---|---|
| Aplay fɔm | Ilɛktrik insuleshɔn, pak, thermoforming, sayn, aplayans, ɔtomotiv ɔ industrial yuz |
| Matirial Gred | Standard HIPS , printin gred, fɔm gred ɔ prɔjek-spɛsifi k rikwaymɛnt |
| Tik we i tik | Tik ɛn tolɛreshɔn we dɛn nid |
| Sayz fɔ di Shit | Di wit × lɔng we dɛn nid; maksimal kɔrɛnt wit lɛk 1600mm |
| Kɔlɔ | Wait, blak ɔ kɔstɔmayt kɔlɔ |
| Sho | Glos, mat, printin surface ɔ ɔda tin we dɛn nid fɔ dɔn |
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Mold saiz, fכm dip, dro rεshכn εn rikwayd fayn wכl tik usay i apɔynt |
| Ilɛktrik Rikwaymɛnt | Dielektrik, resistiviti ɔ ɔda insuleshɔn rikwaymɛnt ɛn tɛst we usay i apɔynt |
| Di Tin dɛn we Yu Go Du fɔ Print | Printin we, ink sistem ɛn rikwayd sɔfayz tritmɛnt usay i apɔynt |
| Rikwaymɛnt fɔ di Rigyuletɔri | Fɔd-kɔntakt, ilɛktroniks, aplayans, motoka ɔ ɔda tin dɛn we dɛn nid |
| Ɔmɔs | Sampul kwantiti, trayal ɔda, rɛgyula ɔda ɛn ɛni ia dimand |
| Usay yu de go | Kɔntri ɛn di pɔt usay dɛn de go |
Sampul Pak: Dɛn kin pak sheet dɛn insay PE bag ɛn katon dɛn we de protɛkt dɛn.
Sheet Packaging: Na lɛk 30kg fɔ wan bag wit PE film ɔ akɔdin to wetin di kɔstɔma nid.
Palet Palet: Na lɛk 500-2000kg fɔ wan plai wud palet.
Kɔntinɛnt Lod: Na lɛk 20 tan ɔnda nɔmal lod kɔndishɔn, we de ɔnda sheet matirial dimɛnshɔn ɛn pak kɔnfigyushɔn.
Dilivri Tɛm dɛn: FOB, CIF, EXW.
Rifrɛns Lid Taym: 7-15 dez afta dipɔsit dipen pan spɛsifikɛshɔn ɛn ɔda volyum.
Ekspɔt Pakin fɔ HIPS Polistayn Shit
HIPS tinap fɔ Ay Impɛkt Polistayn. I na polistayn modifyed wit wan rɔba faz fɔ impɔtant tafnɛs ɛn impak rɛsistɛns kɔmpia wit standad GPPS .
Standard HIPS na ilɛktrik insuleshɔn ɛn dɛn kin tink bɔt am fɔ fayn insul barɛri ɛn pat dɛn we dɛn mek. Projɛkt dɛn we nid wan patikyula dayelɛktrik trɛnk ɔ rɛsistiviti fɔ gi di valyu ɛn tɛst we dɛn nid bifo dɛn gri fɔ di matirial.
Dis HSQY prodak na wan sɔlid 0.2-6mm HIPS sheet matirial , nɔto E PS ɔ XPS fom insuleshɔn bɔd. No bildin R-valyu ɔ tɛmal-kɔnduktiviti spɛsifikɛshɔn nɔ de fɔ dis prɔdak.
HIPS na wan sɔlid rɔba-modifyed polistayn sheet matirial we dɛn kin yuz fɔ tɛmɔfɔm, print ɛn fɔ mek. E PS na εkspεnd polistayn fכm we dεn kin yus fכ tεmral insulεshכn εn fכ protεktiv fכm pak.
Di kɔrɛnt prodakt spɛsifikɛshɔn kɔba lɛk 0.2mm to 6mm. Dɛn kin tɔk bɔt di gej dɛn we dɛn dɔn kɔstɔmayt akɔdin to aw dɛn de yuz am ɛn aw dɛn ebul fɔ mek tin dɛn.
Di HSQY spɛsifikɛshɔn we de naw de list di wit dɛn we go rich lɛk 1600mm. Eksakt avaylabl dipכnt pan tik, kכla εn gred.
Yɛs. Tεmכfכm εn vεkyum fכm na mεjכr HIPS aplikεshכn dεm. Faynal fכm pכrfomans dipכnt pan sheet matirial tik, hεtin profayl, mold jכmetri εn fכm dip.
Yɛs. Yu kin yuz fayn HIPS gred fɔ skrin, dijital ɛn ɔda we dɛn fɔ print. Surface treatment, ink adhesion ɛn curing fɔ tɛst bifo mas prodakshɔn.
Yɛs. HIPS kin tεmכfכm insay trey dɛn , insεt εn prכtektiv pak. Fɔ it, mɛdikal, famasi ɔ ilɛktronik pak, spɛsifa di aplikeshɔn-spɛsifi k matirial ɛn kɔmplians rikwaymɛn.
HIPS na rɔba-modify ɛn nɔmal wan dɛn kin pik am fɔ mek i taf mɔ, fɔ mek i gɛt tɛmɔfɔm ɛn fɔ print. GPPS jεnarali klia εn glos bכt i brit.
Yɛs. HIPS kin kɔt, drɔ, rout ɛn CNC mashin yuz di rayt tul ɛn prɔsesin kɔndishɔn.
Wait ɛn blak na standad opshɔn dɛn we de naw, we dɛn kin tɔk bɔt di kɔlɔ dɛn we dɛn dɔn kɔstɔmayt akɔdin to di gred ɛn ɔda tin dɛn we dɛn nid.
Di minim oda kwantiti naw na 1000kg. Fri stok sɛmpul dɛn de akɔdin to di prɔdak infɔmeshɔn we de naw, wit ɛkspɛs freyt we dɛn gɛda frɔm di pɔsin we bay.
Di kɔrɛnt rɛfrɛns lida tɛm na 7-15 dez afta dipɔsit, dipen pan di prɔdak spɛsifikɛshɔn ɛn ɔda kwantiti.
Duya gi di aplikeshɔn, tik, waid ɛn lɔng, kɔlɔ, sɔfays finish, fɔm ɔ printin prɔses, ilɛktrik ɔ rigyuletɔri rikwaymɛnt, kwantiti ɛn ples fɔ go.
HSQY Plastic Group de saplae HIPS , GPPS ɛn ɔda plastic sheet matirial matirial fɔ tɛmofɔma, pak manifakta, printa, displei manifakta, aplayans prodyusɔ, industrial fabricatɔ ɛn distribyushɔn. Kastom tiknes, kala, sheet matirial saiz ɛn prɔsesin rikwaymɛnt dɛn kin tɔk bɔt akɔdin to di prɔjek.
HSQY Plastik Grup de mit intanashɔnal tɛmfɔma, pak manifakta, fabricatɔ ɛn plastic- sheet matirial bayer na industri ɛgzibishin.
Dɛn fɔ kɔnfyus di sɛtifiket dɛn we de ɛn di tɛst dɔkyumentri fɔ di rayt HIPS gred ɛn di aplikeshɔn we dɛn bin want fɔ yuz bifo dɛn gri fɔ di ɔda.
Di Kategori fɔ Prodakt
Lɛ Wi Fɛn di Rayt Plastik Sɔlv