Electronic packaging film hi specialized film a ni a, electronic component sensitive tak takte dahkhawmna, phurh luh leh dahkhawmna hmuna venhimna atana siam a ni.
Heng film te hi polyethylene (PE), polyester (PET), emaw polypropylene (PP) ang chi thil atanga siam a ni fo thin a, anti-static, conductive, emaw moisture-barrier property an pe thin.
Semiconductor, circuit board leh electronics dangte electrostatic discharge (ESD) leh boruak chhiatna laka venhimna atan an pawimawh hle.
Thil hman tlanglawn tak takte chu low-density polyethylene (LDPE), metallized PET, leh conductive polymers te an ni.
Film thenkhatah chuan conductivity tihsan emaw ESD venhimna atan carbon black emaw metal coating ang chi additives te dah tel a ni.
Barrier layer, aluminium foil emaw ethylene vinyl alcohol (EVOH) te hi tui leh oxygen lut tur venna atan hman a ni a, component rintlak a ni.
Heng film te hian ESD laka venhimna nghet tak an pe a, hei hian electronic component sensitive tak tak a tichhe thei a ni.
Moisture leh dust resistance tha tak an pe a, integrated circuit leh sensor ang chi device te hnathawh dan a humhim bawk.
An lightweight leh flexible nature hian packaging cost a ti tlem a, high-volume manufacturing environment-a efficient handling a pui bawk.
Electronic packaging film hi anti-static emaw conductive property neia engineer a ni a, static charge laka a dissipate emaw shield emaw a ni.
Anti-static film hian charge buildup a ti tlem a, conductive film hian static electricity him taka a discharge theihna tur kawng a siam bawk.
Hei hian electronics him taka hman theihna turin ANSI/ESD S20.20 ang chi industry standard zawm a nih theih nan a pui a ni.
Production process-ah hian extrusion, lamination emaw coating emaw hmanga multilayer film siam a ni a, chu chu venhimna property bik nei a ni.
ESD mamawh phuhruk nan siam chhuah laiin conductive emaw anti-static additives te dah tel a ni.
Branding, barcoding, emaw identification atan precision printing emaw embossing emaw hman theih a ni a, supply chain-ah traceability a awm theih nan.
Thil siamtute chuan quality standard khauh tak, ISO 9001 leh IEC 61340 te chu an zawm a, hei hian performance mumal tak a neih theih nan a pui a ni.
Film te hi surface resistivity, tensile strength, leh barrier property te test thin a ni.
Cleanroom siam hian bawlhhlawh a ti tlem a, hei hi semiconductor leh microelectronics packaging-a hmanna atan a pawimawh hle.
Heng film te hi semiconductor, printed circuit board (PCB), hard drive leh electronic component dang packaging-ah te hman a ni.
Consumer electronics, automotive, aerospace, leh telecommunications ang chi industry-ah te an pawimawh hle.
A hmanna tur chu moisture barrier bag, shielding bag, leh automated assembly line atana tape-and-reel packaging te a ni.
Ni e, electronic packaging film te hi mamawh bikte phuhrukna atan siam theih a ni.
Customization options ah hian thickness hrang hrang, barrier level hrang hrang, component hrang hrang nena inmil turin ESD property hrang hrang a awm a.
Film te hi dimension emaw feature bik neiin design theih a ni bawk a, chu chu resealable zipper emaw vacuum-sealing capabilities emaw hmangin venhimna sang zawk atan hman theih a ni.
Electronic packaging film tam tak hi eco-friendly material hmanga siam a ni a, chu chu recyclable polyethylene emaw biodegradable polymer emaw a ni.
An sakna rit lo tak hian hmanlai packaging nena khaikhin chuan material hman leh transportation emission a tihtlem phah a ni.
Recycling technology lama hmasawnna chuan heng film te hi hman nawn leh theihna a siam a, electronics industry-a circular economy principle nen a inmil hle.