HI PS shit Manufacturer fɔ Tɛmofɔmin ɛn Printin
HSQY PLASTIC de mek ɛn saplae HIPS sheet matirial s fɔ thermoforming, vaykum fɔm, printin, sayn, displei, frij layna, aplayans pat, pak trey dɛn , industrial kɔva ɛn ilɛktronik pak.
HIPS tinap fɔ Ay Impɛkt Polistayn . Na rɔba-modifyed polistayn matirial we dɛn divɛlɔp fɔ gi big tafnɛs ɛn impak rɛsistɛns pas jenɛral-pɔpɔs polistayn we i de kip gud rigiditi, printabiliti ɛn fɔm pefɔmɛns.
HSQY in kɔrɛnt standad HIPS sheet matirial rɛnj kɔba lɛk 0.2–6 mm tiknɛs , wit dɛn we go rich lɛk 1600 mm , standad 1220 × 2440 mm / 4 × 8 ft sheet matirial s, ɛn wayt, blak, kɔlɔ ɛn kɔstɔm-kɔlɔ opshɔn dɛn.
HSQY de saplae bak spɛshal blak ESD ɛn anti-statik HIPS sheet matirial ɛn rol fɔ ilɛktronik pak aplikeshɔn dɛn. Ilɛktrik pefɔmɛns fɔ pik akɔdin to di sɔfayz rɛsistɛns ɛn tɛst we dɛn nid pas fɔ pik di prɔdak kɔlɔ nɔmɔ.
Wetin Na HI PS shit ?
HIPS sheet matirial na wan εkstrud tεmכplastik sheet matirial we dεn mek wit polistayn we dεn modify wit wan impak-εnhans rכba fεz.
Standart jenɛral-pɔpɔs polistayn na rigid bɔt kɔmparativ brit. Di rɔba modifyeshɔn we dɛn yuz na HIPS de impruv tafnɛs ɛn rɛsistɛns to krak, we de mek HIPS mɔ fit fɔ thermoformed trey dɛn , aplayans layna, print displei ɛn fabricated kɔmpɔnɛnt dɛn.
HIPS na kɔmɔn we dɛn kin pik usay wan prɔjek nid fɔ gɛt ikɔnomik kɔmbaynshɔn we gɛt rigiditi, impak rɛsistɛns, tɛmɔfɔmabiliti, printabiliti ɛn izi fɔ mek we nɔ nid di ay pefɔmɛns lɛvɛl fɔ mɔ dia dia injinɛri plastic.
HI PS shit Spɛsifikeshɔn dɛn
| Sɔntin |
High Impact Polistayn Shit / HIPS Plastik shit |
| Tin dɛn |
Rɔba-Modifyed Polistayn / Ay Impɛkt Polistayn |
| Standart Tiknɛs Rɛnj |
Na lɛk 0.2–6 mm |
| Tiknɛs dɛn we dɛn dɔn sho |
0.5 mm, 1.0 mm, 2.0 mm ɛn kɔstɔmayt gej dɛn |
| Standart Shit Sayz |
1220 × 2440 mm / lɛk 4 × 8 ft |
| Maksimal Kɔrɛnt Width |
aprכksimatli 1600 mm fכ di kכrant standad HIPS prodakt famili |
| Kɔlɔ dɛn |
Wait, blak, kala ɛn kɔstɔm kɔlɔ dɛn |
| Standart Sɔfays |
Smɔl sɔfays; glos, tɛkstɔr ɔ aplikeshɔn-spɛsifi k sɔfays rikwaymɛnt dɛn fɔ kɔnfyus bay gred |
| Fɔm fɔ di Sapɔt |
Flat sheet matirial s ɛn sɛlɛkɛt rolstɔk spɛsifikɛshɔn dɛn |
| Di we aw dɛn de du di wok |
Tɛmofɔmin, vaykum fɔm, day kɔt, CNC kɔt, drɔlin, printin, peint ɛn lamin |
| Spɛshal Gret |
Blak ESD / anti-statik HIPS de fɔ sɔm ilɛktronik pak aplikeshɔn dɛn we dɛn dɔn pik |
| Men Aplikeshɔn dɛn |
Pat dɛn we dɛn mek wit tɛmɔfɔm, frij layna, aplayans kɔmpɔnɛnt dɛn, pak trey dɛn , sayn, displei, print grafik ɛn ilɛktronik pak |
Ki Bɛnifit dɛn fɔ di High Impact Polistyrene Sheet
Gud Tɛmofɔmin Pɔfɔmɛnshɔn: HIPS kin ɔt ɛn fɔm insay trey dɛn , layna, kɔva, haus ɛn ɔda tri-dimɛnshɔnal pat dɛn we yu de yuz fayn tɛmfɔmin ikwipmɛnt.
Improved Toughness: Rɔba modifyeshɔn de gi big rɛsistɛns to impak ɛn krak pas standad GPPS .
Gud Printabiliti: Suitabl HIPS sɔfays kin sɔpɔt skrin printin, dijital printin ɛn ɔda printin prɔses afta dɛn dɔn kɔnfyus di kɔmpatibiliti ɛn sɔfa-tritmɛnt rikwaymɛnt dɛn.
Izi Fabrikɛshɔn: HIPS kin kɔt, drɔl, rout, day-kɔt, laminɛt ɛn mek am insay kɔstɔmayz kɔmpɔnɛnt dɛn.
Gud Dimɛnshɔnal Stebiliti: HIPS de gi yusful balans fɔ rigiditi ɛn tafnɛs fɔ trey dɛn , sayn, layna ɛn panɛl dɛn we dɛn mek.
Kastɔm Kɔlɔ dɛn: Dɛn kin gi wayt, blak ɛn kɔstɔmayt kɔlɔ sheet matirial s akɔdin to di prɔdak dizayn rikwaymɛnt dɛn.
Kɔst-Ɛfɛktiv Prɔsesin: HIPS na tin we bɔku pipul dɛn kin tink bɔt fɔ ay-volyum fɔm ɛn printin aplikeshɔn usay dɛn nid fɔ yuz ikɔnomik tɛmplastik sheet matirial .
Standart HIPS vs. ESD HI PS shit
| Ficha |
Standart HIPS |
ESD / Anti-Statik HIPS |
| Men Fɔnkshɔn |
Jɛnɛral impak-rɛsistant fɔm ɛn fabrikeshɔn |
Fɔm plus aplikeshɔn-spɛsifi k statik-kɔntrol pefɔmɛns |
| Tiknes HSQY we de naw |
Na lɛk 0.2–6 mm |
aprכksimatli 0.2–1.8 mm pan di kכrant dεdikεt ESD prodakt |
| Kɔlɔ |
Wait, blak ɛn kɔstɔm kɔlɔ dɛn |
Di HSQY dediket ESD prodakt naw na blak |
| Tipik Aplikeshɔn dɛn |
Displei, layna, pak, thermoformed pat ɛn print panɛl |
IC, PCB, PCBA, SMT ɛn ilɛktronik-kɔmpɔnɛnt trey dɛn ɔ protɛktiv pak |
| Ilektrikal Spɛsifikeshɔn |
Nɔto nɔmal fɔ spɛsifa fɔ statik-kɔntrol aplikeshɔn dɛn |
Target surface resistance ɛn test method fɔ kɔnfɔm bifo dɛn ɔda |
Anti-statik, statik-dissipativ ɛn kɔnduktiv nɔto wɔd dɛn we dɛn kin chenj. Di wan dɛn we de bay ilɛktronik-pak fɔ gi di ilɛktrik rɛsistɛns rɛnj we dɛn nid, tɛst prosidur ɛn savis ɛnvayrɔmɛnt we dɛn de aks fɔ ESD matirial.
HI PS shit fɔ Tɛmofɔmin
Tɛmofɔmin na wan pan di impɔtant aplikeshɔn fɔ Ay Impɛkt Polistayn sheet matirial .
we dεn de tεmכfכm, dεn de hεt HIPS sheet matirial te i bi inof pliable εn afta dat dεn de fכm am εgεst wan mold we dεn de yuz vεkyum, prεshכn כ mεkanikal εp.
Aplikeshɔn dɛn inklud aplayans layna, pak trey dɛn , displei kɔmpɔnɛnt, ɔtomotiv intɛriɔ pat, haus, kɔva ɛn ɔda fɔm kɔmpɔnɛnt dɛn.
Fɔ dip-dro pat, di wan dɛn we de bay fɔ gi di ɔrijinal sheet matirial tik, di kaviti dip, drɔ rishɔ, mold dimɛnshɔn ɛn di tik we dɛn nid fɔ dɔn di wɔl so dat dɛn go ebul fɔ evalyu di statin gej.
HI PS shit fɔ Vaykum Fɔm
HIPS na fכs fכ sεlekt f כ vεkyum f כm biכs suitable grεd kin prodyuz ditayl tri-dimεnshכnal kכmכpכnεnt dεm we de yuz rili strεt fכm prכsεs.
Vaykum-fɔmin pefɔmɛns fɔ evalyu yuz di aktual mold, ɔt sistɛm ɛn fɔm dip bikɔs if yu strɛch pasmak i kin ridyus di tik we di wɔl tik na kɔna ɛn dip kaviti.
Bifo mas prodakshɔn, tɛst pat difinishɔn, wɔl-tiknɛs distribyushɔn, shrinkage, trim, flatnɛs ɛn fayn impak pefɔmɛns.
HI PS shit fɔ Print ɛn Sayn
HIPS kin gi wan smol say we yu kin print fɔ pɔynt-ɔf-pɔch displei, sayn, grafik panɛl, prɔmoshɔnal bod ɛn branded kɔmpɔnɛnt dɛn.
Dipen pan di printin sistem, di rayt gred dɛn kin sɔpɔt skrin printin, UV ɔ dijital printin ɛn ɔda kɔmɛshɔnal print prɔses dɛn.
Print pefɔmans dipen pan sɔfayz ɛnaji, sɔfa tritmɛnt, ink kemistri, we fɔ mɛn ɛn sɔfa finish. If korona tritmɛnt ɔ wan spɛsifikɛd dayn lɛvɛl nid fɔ de, put am insay di spɛsifikɛshɔn fɔ bay pas fɔ tek am se ɛvri HIPS gred gɛt di sem sɔfayz tritmɛnt.
HIPS fɔ Frij Layna ɛn Aplayans Pat dɛn
High Impact Polystyrene na tin we bɔku pipul dɛn kin tink bɔt fɔ frij intɛriɔ kɔmpɔnɛnt ɛn aplayans aplikeshɔn bikɔs i kin jɔyn rigiditi, fɔm kapabiliti, sɔfays apinans ɛn impak rɛsistɛns.
Di tin dɛn we pɔsin kin yuz na frij intɛriɔ layna, drɔwa kɔmpɔnɛnt, aplayans haus, kɔva ɛn thermoformed intɛriɔ panɛl.
Di aplayans projɛkt dɛn fɔ spɛsifa di opareshɔn tɛmpracha, ditarjen ɔ kemikal ɛksplɔshɔn, impak rikwaymɛnt, kɔlɔ, glos, fɔm dip ɛn ɛni aplikebul aplayans standad.
HI PS shit fɔ Pakɛj ɛn Trey
Tin HIPS sheet matirial kin tεmכfכm insay trey dɛn , insεt, prכtektiv pak, kכsmεtik pak εn industrial kכmכpכnt pak.
Di wan dɛn we de bay pak fɔ difayn fɔm dip, pat rigiditi, impak rikwaymɛnt, stakabiliti, kɔlɔ ɛn ɛni it-kɔntakt, famasitik ɔ ilɛktronik-pakej rikwaymɛnt bifo dɛn pik wan gred.
ESD HI PS shit fɔ Ilɛktronik Pakɛj
HSQY in blak ESD HIPS prodakt na fɔ thermoformed ilɛktronik pak lɛk IC trey dɛn , sɛmikɔndɔkta trey dɛn , PCB ɛn PCBA trey dɛn , FPC kyaria, SMT kɔmpɔnɛnt trey dɛn ɛn protɛktiv kɔmpɔnɛnt pak.
Di kɔrɛnt dediket ESD prodakt de insay lɛk 0.2–1.8 mm tik ɛn dɛn kin saplae am insay kɔstɔmayz sheet matirial ɔ rol fɔmat.
Bikɔs thermoforming kin strɛch di matirial ɛn chenj lokal wɔl tik, ESD pefɔmɛns fɔ kɔnfɔm pan di finish fɔm tre we ilɛktrik rɛsistɛns na krichɔl.
Wait, Blak ɛn Kɔlɔ High Impact Polistayn (HIPS) Shit dɛn
| Kɔlɔ |
Tipik Sɛlɛkshɔn Dairekshɔn |
| Wait HIPS |
Aplayans layna, printin, sayn, displei ɛn thermoformed prodak |
| Blak HIPS |
Indastrial kɔva, displei, fɔm prodak ɛn spɛshal ilɛktronik pak |
| Kɔlɔ HIPS we gɛt kɔlɔ. |
Ritayl displei, branded prodak, dekorativ pat ɛn prodak-spɛsifi k aplikeshɔn |
| Kastom Kɔlɔ |
Yu kin tɔk bɔt aw fɔ mach di kɔlɔ bay we yu yuz fizik sampul, kɔlɔ rɛfrɛns ɔ we dɛn dɔn gri fɔ tɔch |
Aw fɔ Pik HI PS shit Tiknɛs
Di korekt HIPS tiknes dipen pan pat saiz, fom dip, rikwayd stiffness, impak rikwaym, printin proses en fabrication method.
| Tiknes Rɛnj |
Jɛnɛral Sɛlɛkshɔn Dairekshɔn |
| 0,2–0,5 mm |
Tin pak, ilɛktronik trey dɛn , insɛt ɛn laytwɛt tɛmɔfɔm aplikeshɔn dɛn |
| 0,5–1,0 mm |
Packaging trey dɛn , print panɛl, displei ɛn laytwɛt fɔm kɔmpɔnɛnt dɛn |
| 1,0–2,0 mm |
Big big pat dɛn we dɛn mek wit tɛm, di kɔmpɔnɛnt dɛn fɔ di aplayans, di displei dɛn ɛn di kɔva dɛn we de protɛkt dɛn |
| 2,0–4,0 mm |
Mɔ rigid sayn dɛn, fɔm pat dɛn, layna dɛn ɛn industrial fabricated kɔmpɔnɛnt dɛn |
| 4,0–6,0 mm |
Hevi-gej fכm כ fabricated aplikεshכn dεm we nid big stat- sheet matirial rigiditi |
Fɔ thermoforming, stat tiknes fɔ pik yuz di finish pat jɔyometri bikɔs dip drɔin kin rili ridyus lokal wɔl tik.
4 × 8 HI PS shit
HSQY de saplae standad 1220 × 2440 mm HIPS sheet matirial s , we dɛn kin kɔl lɛk 4 × 8 ft sheet matirial s.
Dis fɔmat yusful fɔ distribyushɔn, sayn manifakta, tɛmɔfɔma ɛn fabricatɔ we de yuz standad sheet matirial -prosɛsin ikwipmɛnt.
Dɛn kin tɔk bak bɔt di kɔstɔm dimɛnshɔn ɛn wit we go rich lɛk 1600 mm akɔdin to di tik ɛn di tin dɛn we dɛn nid fɔ mek.
HI PS shit vs. GP PS shit
| Ficha |
HIPS |
GPPS |
| Matirial Strukchɔ |
Polistayn we dɛn dɔn chenj wit rɔba |
Jɛnɛral-pɔpɔs polistayn |
| Aw a luk |
Kɔmɔn fɔ mek i nɔ de shayn |
Kɔmɔn fɔ transparent ɛn glos |
| Impakt Resistans fɔ mek pɔsin nɔ gɛt prɔblɛm |
Higher bikɔs ɔf rɔba modifyeshɔn |
Mɔ brittle |
| Di men tin we yu fɔ pik fɔ pik |
Tafnɛs, fɔm ɛn printin |
Transperensi, rigiditi ɛn ikɔnomik klia sheet matirial |
| Tipik Aplikeshɔn dɛn |
Tɛmofɔm trey dɛn , displei, aplayans layna ɛn print prodak |
Klia displei, freym, transparent panɛl ɛn dɛkɔretiv aplikeshɔn dɛn |
Fɔ aplikeshɔn dɛn we nid klia jenɛral-pɔpɔs polistayn, rivyu wi GPPS shit.
HI PS shit vs. ABS Shit
| Selekshɔn Faktɔ |
HIPS |
ABS |
| Tipik Pozishɔn |
Ikonomik fɔm ɛn printin matirial fɔ midul-diuti aplikeshɔn dɛn |
Ɛnjinia tɛmplastik fɔ aplikeshɔn dɛn we nid difrɛn balans pan trɛnk, tafnɛs ɛn tɛmpracha pefɔmɛns |
| Tɛmofɔmin we dɛn de mek |
Widely yuz fɔ kɔst-ɛfɛktiv thermoformed prodak dɛm |
Also kɔmɔn thermoformed fɔ mɔ dimand komponent dɛn |
| Fɔ print |
Strɔng aplikeshɔn fit wit fayn print-grɛd sɔfays |
Printin dipen pan ABS surface ɛn prɔsesin rikwaymɛnt |
| Tipik Disishɔn fɔ Pɔch |
Pik we ikɔnomik fɔmabiliti ɛn printabiliti na prɔyorities |
Evaluate wen di finish komponɛnt nid fɔ gɛt ay injinɛri pefɔmɛns |
Fɔ mɔ dimand injinɛri-plastik aplikeshɔn, kɔmpia di prɔjek rikwaymɛnt wit wi ABS Shit dɛn.
Impɔtant Limiteshɔn dɛn fɔ HI PS shit
HIPS na versatile, bɔt i nɔ fɔ ɔtomɛtik trit am lɛk injinɛri plastic fɔ ɛvri envayrɔmɛnt.
UV Ɛksplɔshɔn na do
Standard HIPS gɛt limited lɔng tɛm UV rɛsistɛns. Di aplikeshɔn dɛn na do fɔ yuz wan aplikeshɔn-spɛsifi k UV-stabilized fɔmyulashɔn ɔ ɔda tin we nɔ de ambɔg di wɛda we dɛn de ɛkspɛkt fɔ de na di san fɔ lɔng tɛm.
Aplikeshɔn dɛn we gɛt ay Tɛmpratura
HIPS nɔ fɔ pik ɔl bay matirial nem fɔ ɛlevɛt-tɛmpracha aplikeshɔn dɛn. Spɛsifik kɔntinyu ɛn pik tɛmpracha so dat dɛn go ebul fɔ evaluate di aktual gred.
Kεmikכl εkspכzכn
Kεmikכl rεsistεns dipכnt pan di sכbstans, kכnsantreshכn, tεmprachכ εn strεs we dεn aplay to di kכmכpכnt we dεn dכn. Test di aktual klin, ɔyl, sɔlvɛnt ɔ prɔses kemikal bifo dɛn gi yu di las aprɔval.
Fɔd-Kɔntakt HI PS shit
Standard industrial HIPS nɔ fɔ ɔtomɛtik diskrayb as fud-kɔntakt kɔmpliant.
If HIPS go yuz fɔ pak it, frij fud-kɔntakt kɔmpɔnɛnt ɔ ɔda rigyulayt aplikeshɔn, gi di dɛstineshɔn makit, di kayn it, kɔntakt kɔndishɔn ɛn rigyuleshɔn we dɛn nid bifo yu pik di matirial.
Rigyuletɔri dɔkyumentri fɔ kɔnfyus fɔ di ɛksaktɔl saplai rɛsin fɔmyulashɔn, kɔlɔ ɛn gred.
Aw fɔ Pik di Rayt HI PS shit
1. Difayn di Aplikeshɔn
Spɛsifik tɛm fɔm, vaykum fɔm, printin, frij layna, aplayans pat, pak, sayn, displei ɔ ilɛktronik pak.
2. Selekt Stɛndad ɔ ESD HIPS
Standard HIPS fayn fɔ jenɛral fɔm ɛn printin, we ilɛktronik pak kin nid fɔ gɛt difayn anti-statik, dissipativ ɔ kɔnduktiv gred.
3. Kɔnfɔm Tiknɛs
HSQY naw de saplae standad HIPS in aprכksimatli 0.2–6 mm. di pat dεm we dεn tεmכfכm fכ evaluate akɔdin to di fayn wכl tik εn drכ dip.
4. Kɔnfɛm Shit Sayz ɔ Rol Fɔmat
Standart 1220 × 2440 mm sheet matirial s de. Gi mashin wit, mold saiz ɔ rikwayd finish sheet matirial dimɛnshɔn fɔ kɔstɔmayz saplai.
5. Pik di Kɔlɔ
Spɛsifik wayt, blak ɔ kɔstɔm kɔlɔ. Gi wan aprɔv fizik sampul ɔ rɛkɔgnayz kɔlɔ rɛfrɛns we dɛn nid fɔ klos kɔlɔ maching.
6. Kɔnfɛm di tin dɛn we yu nid fɔ print
Gi di we aw dɛn de print, di ink sistem, di tritmɛnt we dɛn nid fɔ mek di say we dɛn de print ɛn di tin we dɛn nid fɔ mek di dayn usay i pɔsibul.
7. Kɔnfɔm di Tɛmofɔmin Rikwaymɛnt dɛn
Gi fɔm dip, mold dimɛnshɔn, vaykum ɔ prɛshɔn fɔm prɔses ɛn rikwayd finish wɔl tik.
8. Kɔnfɔm di Savis Envayrɔmɛnt
Spɛsifik yus insay ɔ na do, savis tɛmpracha, kemikal ɛksplɔshɔn ɛn mɛkanikal-impakt rikwaymɛnt dɛn.
9. Kɔnfɔm di Rigyuletɔri Rikwaymɛnt dɛn
If it kɔntakt, ilɛktroniks, flaym pefɔmɛns ɔ ɔda rigyuleted rikwaymɛnt de aplay, no di rayt standad bifo yu gri fɔ di matirial.
10. Test wan Prodakshɔn Sampul
Evaluate di matirial wit di aktual printin, fom, kot o asembli proses bifo yu apruv big customized oda.
Kastom HI PS shit Manufakchurin
HSQY de sɔpɔt kɔstɔmayz HIPS sheet matirial prɔjek fɔ tɛmfɔma, aplayans manifakta, pak kɔmni, printin kɔmni, sayn manifakta, ilɛktronik-pak saplay ɛn plastic distribyushɔn.
Di kɔstɔm opshɔn dɛn kin inklud:
Kastom tiknes insay fayn prodakshɔn rɛnj
1220 × 2440 mm standad sheet matirial s
Kastom sheet matirial dimɛnshɔn dɛn
Widths up to approximately 1600 mm fɔ di standad prodak dɛm we de naw
Wait ɛn blak HIPS
Kastom kɔlɔ dɛn
Aplikeshɔn-spɛsifi k printin sɔfays dɛn
Tɛmofɔmin ɛn vaykum-fɔmin gred dɛn
Blak ESD HIPS sheet matirial ɛn rol
Panɛl dɛn we dɛn kɔt to saiz
Day we de kɔt
CNC we dɛn de kɔt
Fɔ drɔl
Print ɛn laminating rikwaymɛnt dɛn
Kastom ɛkspɔt pakej
HI PS shit Kwaliti Kɔntrol
Impɔtant inspekshɔn ɛn aprɔval paramita dɛn kin inklud:
Sheet tik ɛn tolɛreshɔn
Wid ɛn lɔng tolɛreshɔn
Sheet we de flat
Di kɔnsistɛns we di kɔlɔ dɛn gɛt
Di we aw di wɔl de luk
Impekt pefɔmɛns usay dɛn spɛsifa am
Rigiditi we pɔsin kin gɛt
Tɛmofɔmin pefɔmɛns
Shrinkage afta fɔm usay i rili impɔtant
Print adhesion usay dɛn nid am
Surface tritmεnt usay dεn spεsifi k
ESD surface resistance usay dɛn nid am
Dimɛnshɔn dɛn fɔ kɔt ɛn fɔ mek tin dɛn
Pak ɛn palet kɔndishɔn
Pak ɛn Intanɛshɔnal Shipin
HIPS sheet matirial s kin pak akɔdin to sheet matirial saiz, tik, sɔfa ɛn transpɔt rikwaymɛnt.
Protektiv rap, kraft pepa, PE film, katon ɔ palletized ɛkspɔt pak kin tɔk bɔt akɔdin to di kɔnfyus prodak spesifikeshɔn.
Fɔ rolstɔk ɔ tin-gej matirial, gi di rol wit we dɛn nid, di wet we di rol gɛt, di tin dɛn we dɛn nid fɔ du na di kɔr ɛn di tin dɛn we dɛn nid fɔ du fɔ mek di thermoforming-machine bifo dɛn mek am.
Wetin Mek Yu Pik HSQY as Yu HI PS shit Manufacturer?
0.2–6 mm Standart Rεnj: HSQY in kכrant standad HIPS prodakt dεm kכba tin-gεj fכm mεtirial dεm tru hεvi fכbrik sheet matirial s.
4 × 8 Shit Saplai: Standart 1220 × 2440 mm HIPS sheet matirial s de fɔ distribyushɔn, tɛmfɔma, printa ɛn fabrikta.
Kastɔm Kɔlɔ dɛn: Wi kin tɔk bɔt wayt, blak, kɔlɔ ɛn prɔjek-spɛsifi k kɔlɔ we dɛn nid.
Tɛmofɔmin Aplikeshɔn: Dɛn kin pik matirial fɔ vaykum fɔm ɛn thermoforming akɔdin to tik, pat jɔyometri ɛn fɔm dip.
Printin Aplikeshɔn: HIPS kin saplae fɔ sayn, grafik ɛn displei projɛkt usay printabiliti ɛn fabrikeshɔn impɔtant.
ESD HIPS : HSQY de saplae blak ESD HIPS bak fɔ ilɛktronik pak projɛkt dɛn we nid difayn statik-kɔntrol pefɔmɛns.
Kastɔm Prɔsesin: Dɛn kin tɔk bɔt fɔ kɔt, day kɔt, CNC fabrication, printin ɛn ɔda prɔsesin rikwaymɛnt dɛn akɔdin to drɔin ɛn sɛmpul dɛn.
Material Alternatives: HSQY de saplae bak GPPS shit fɔ transparent polistayn aplikeshɔn ɛn ABS Shit fɔ prɔjek dɛn we nid difrɛn injinɛri-pɔfɔmɛnshɔn balans.
Infɔmeshɔn Nid fɔ wan HI PS shit Kɔt
| Aplay fɔm |
Tɛmofɔmin, printin, frij layna, pak, sayn, displei, ilɛktroniks ɔ ɔda aplikeshɔn |
| HIPS Gret we yu de du |
Standart, printin, fɔm, ESD ɔ rɛkɛmɔndeshɔn nid fɔ de |
| Tik we i tik |
Tik ɛn tolɛreshɔn we dɛn nid |
| Sayz fɔ di Shit |
1220 × 2440 mm ɔ kɔstɔm wit × lɔng |
| Fɔm fɔ di Sapɔt |
Flat sheet matirial , kɔt sheet matirial ɔ rolstɔk usay i de |
| Kɔlɔ |
Wait, blak ɔ kɔstɔm kɔlɔ |
| Surface / Printin we yu de print |
Printin prɔses, surface finish, korona tritmɛnt ɔ dayne rikwaymɛnt usay i apɔynt |
| Tɛmofɔmin we dɛn de mek |
Fɔm dip, mold dimɛnshɔn, prɔses ɛn rikwayd finish wɔl tik |
| ESD Rikwaymɛnt |
Target surface resistance, test method ɛn kondishɔn ɛnvayrɔmɛnt usay nid de |
| Rikwaymɛnt fɔ di Rigyuletɔri |
Fɔd-kɔntakt, flaym, ilɛktroniks ɔ ɔda standad we dɛn kin yuz |
| Ɔmɔs |
Trayal kwantiti, rɛgyula ɔda kwantiti ɛn ɛstimat ɛni ia dimand |
| Usay yu de go |
Di kɔntri we dɛn de go ɛn di pɔt |
HI PS shit FAQ we yu kin aks
Wetin HIPS tinap fɔ?
HIPS tinap fɔ Ay Impɛkt Polistayn. I na polistayn we dɛn dɔn modify wit rɔba faz fɔ mek i taf ɛn impɔk rɛsistɛns we yu kɔmpia am wit jenɛral-pɔpɔs polistayn.
Wetin dɛn de yuz HIPS sheet matirial fɔ?
HIPS sheet matirial s dɛn kin yuz fɔ thermoformed trey dɛn , frij layna, aplayans pat, print grafik, sayn, displei, pak, industrial kɔva ɛn spɛshal ilɛktronik pak.
HIPS na di sem wit nɔmal polistayn?
Nɔ. HIPS na wan kayn polistayn we dɛn dɔn chenj wit rɔba we dɛn mek fɔ mek i gɛt mɔ taf. GPPS jεnarali na mכr rigid εn transparent bכt i de mכr brital bak.
Wetin na di difrɛns bitwin HIPS ɛn GPPS ?
HIPS na in dɛn kin pik fɔ impak rɛsistɛns, tɛmfɔmin ɛn printin. GPPS na tin we dɛn kin pik fɔ transparent ɛn glos aplikeshɔn usay dɛn nid fɔ gɛt mɔ klia.
Wetin na di difrɛns bitwin HIPS ɛn ABS?
HIPS na in dɛn kin pik bɔku tɛm fɔ ikɔnomik tɛmfɔmin ɛn printin aplikeshɔn dɛn, we dɛn kin ebul fɔ evaluate ABS we wan prɔjek nid difrɛn balans pan injinɛri trɛnk, tafnɛs ɛn tɛmpracha pefɔmɛns.
Yu tink se HIPS sheet matirial kin thermoformed?
Yɛs. Tεmכfכm na wan pan di mεjכr aplikεshכn fכ HIPS . I kin fɔm insay trey dɛn , layna, kɔva, haus ɛn bɔku ɔda tri-dimɛnshɔnal kɔmpɔnɛnt dɛn.
Yu tink se HIPS sheet matirial kin bi vaykum fɔm?
Yɛs. Suitabl HIPS gred kin bi vaykum fɔm. Wan prodakshɔn trayal fɔ verify mold difinishɔn, fayn wɔl tik, shrinkage ɛn finish-pat pefɔmɛns.
HIPS sheet matirial yu kin print?
Yɛs. HIPS na tin we dɛn kin yuz bɔku bɔku wan fɔ sayn ɛn grafik dɛn we dɛn print. Di kɔmpitishɔn fɔ print dipen pan di sɔfa, ink, di we aw dɛn de mɛn ɛn if dɛn nid fɔ gɛt korona ɔ ɔda tritmɛnt fɔ di say we dɛn de.
Us tiknes HIPS sheet matirial HSQY de saplae?
HSQY in kכrant standad HIPS prodakt famili kכba aprכksimatli 0.2–6 mm, inklud fכm 0.5 mm, 1 mm εn 2 mm sheet matirial s.
HSQY de saplae 4 × 8 HIPS sheet matirial s?
Yɛs. HSQY de saplae 1220 × 2440 mm HIPS sheet matirial s, we dɛn kin tɔk bɔt as lɛk 4 × 8 ft.
Wetin na di maksimal HIPS sheet matirial wit?
Di standad HSQY HIPS prodak pej dεm we de naw de list di wit dεm we de rich lεk 1600 mm. Konfam maksimal we de fɔ di tik we yu nid bifo yu ɔda.
Us kɔlɔ dɛn fɔ HIPS sheet matirial de?
HSQY de saplae wayt, blak, kala ɛn kɔstɔm-kɔlɔ HIPS sheet matirial s.
HSQY de saplae ESD HIPS sheet matirial ?
Yɛs. HSQY naw de saplae wan blak ESD HIPS prodak in aprɔksimatli 0.2–1.8 mm tiknes fɔ sɔm sɛlɛkɛt ilɛktronik pak aplikeshɔn dɛn.
Anti-statik HIPS na di sem wit kɔnduktiv HIPS ?
Nɔ. Anti-statik, statik-dissipativ ɛn kɔnduktiv matirial dɛn de tɔk bɔt difrɛn ilɛktrik-pɔfɔmɛnshɔn rɛnj dɛn. Spɛsifik di sɔfayz rɛsistɛns ɛn tɛst we yu nid bifo yu pik di matirial.
Yu tink se ESD HIPS kin thermoformed?
Yɛs. HSQY in kɔrɛnt ESD HIPS prodakt na fɔ thermoformed ilɛktronik trey dɛn ɛn kɔmpɔnɛnt kyaria dɛn. Ilɛktrik pefɔmɛns fɔ tɛst bak afta dɛn dɔn fɔm.
HIPS fayn fɔ yuz na do?
Standard HIPS gɛt limited resistans to lɔng UV ɛksplɔshɔn. Di projɛkt dɛn we de na do fɔ sho wan fayn gred we UV-stabiliz ɔ fɔ evalyu ɔda plastic we nɔ de ambɔg di wɛda.
Na HIPS nɔ gɛt ɔt?
HIPS de gi yusful pefɔmɛns fɔ bɔku rum-tɛmpracha ɛn mɔdaret-tɛmpracha aplikeshɔn dɛn, bɔt dɛn nɔ fɔ trit am lɛk ay-tɛmpracha injinɛri plastic. Spɛsifik di ɔpreshɔn tɛmpracha we yu nid bifo yu pik wan gred.
HIPS fayn fɔ frij layna?
HIPS na tin we dɛn kin tink bɔt fɔ frij intɛriɔ layna ɛn aplayans kɔmpɔnɛnt dɛn bikɔs ɔf in kɔmbaynshɔn fɔ fɔm pefɔmɛns, rigiditi ɛn tafnɛs. Di ɛksaktɔl aplayans spɛsifikɛshɔn fɔ stil validet.
HIPS it sef?
Fɔd-kɔntakt suitability na gred-spɛsifi k. Nɔ tink se ɛvri industrial HIPS sheet matirial fayn fɔ kɔntakt it. Kɔnfɛm di ɛksaktɔl fɔmyulashɔn ɛn di dɛstineshɔn-maket rigyuleshɔn we dɛn nid bifo yu ɔda.
Yu tink se HIPS sheet matirial kin kɔt ɛn drɔ?
Yɛs. HIPS kin kɔt, CNC mashin, drɔ, day-kɔt ɛn mek yuz fayn plastic-prɔsɛsin ikwipmɛnt.
HSQY kin kɔstɔmayz HIPS sheet matirial saiz dɛn?
Yɛs. Standard 1220 × 2440 mm sheet matirial s ɛn kɔstɔmayz dimɛnshɔn, tik, wit ɛn kɔlɔ dɛn kin tɔk bɔt akɔdin to di prɔjek rikwaymɛnt dɛn.
HSQY kin mach wan HIPS sampul we dɔn de?
Wan sampul we dɔn de kin evalyu togɛda wit tik, kɔlɔ, sɔfa, fɔm, printin ɛn pefɔmɛns rikwaymɛnt fɔ no wan aprɔpriet spɛsifikɛshɔn.
A kin aks fɔ HIPS sampul dɛn?
Dɛn kin tɔk bɔt di sampul dɛn we de fɔ evaluate tiknes, kɔlɔ, sɔfays, printin, thermoforming ɛn aplikeshɔn pefɔmɛns bifo dɛn ɔda bɔku bɔku wan.
Us infɔmeshɔn a fɔ gi fɔ HIPS kot?
Gi aplikeshɔn, tiknes, wit ɛn lɔng, kɔlɔ, sheet matirial ɔ rol rikwaymɛnt, printin ɔ fɔm prɔses, ESD rikwaymɛnt usay i apɔynt, kwantiti ɛn dɛstineshɔn.
Rikwest wan HI PS shit Kot
Yu de luk fɔ wan rilibul HIPS sheet matirial manifakta , ay impak polistayn saplay ɔ kɔstɔm matirial fɔ tɛmfɔmin, vaykum fɔm, printin, aplayans ɔ ilɛktronik-pak aplikeshɔn?
Send HSQY yu tiknes we yu nid, sheet matirial dimɛnshɔn, kɔlɔ, fɔm ɔ printin prɔses ɛn ɛstimat kwantiti we yu bay. Fɔ ESD pak, inklud di sɔfayz rɛsistɛns ɛn tɛst we dɛn nid so dat dɛn go ebul fɔ evaluate di fayn matirial.
