HSQY PLASTIC de mek ɛn saplae HIPS sheet fɔ thermoforming, vaykum fɔm, printin, sayn, displei, frij layna, aplayans pat, pak trey, industrial kɔva ɛn ilɛktronik pak.
HIPS tinap fɔ Ay Impɛkt Polistayn . Na rɔba-modifyed polistayn matirial we dɛn divɛlɔp fɔ gi big tafnɛs ɛn impak rɛsistɛns pas jenɛral-pɔpɔs polistayn we i de kip gud rigiditi, printabiliti ɛn fɔm pefɔmɛns.
HSQY in kɔrɛnt standad HIPS shit rɛnj kɔba lɛk 0.2–6 mm tiknɛs , wit we go rich lɛk 1600 mm , standad 1220 × 2440 mm / 4 × 8 ft shit, ɛn wayt, blak, kɔlɔ ɛn kɔstɔm-kɔlɔ opshɔn dɛn.
HSQY de saplae spɛshal blak ESD ɛn anti-statik HIPS shit ɛn rol bak fɔ ilɛktronik pak aplikeshɔn dɛn. Ilɛktrik pefɔmɛns fɔ pik akɔdin to di sɔfayz rɛsistɛns ɛn tɛst we dɛn nid pas fɔ pik di prɔdak kɔlɔ nɔmɔ.
HIPS sheet na wan extruded thermoplastic sheet we dɛn mek wit polystyrene we dɛn modify wit wan impak-ɛnhans rɔba faz.
Standart jenɛral-pɔpɔs polistayn na rigid bɔt kɔmparativ brit. Di rɔba modifyeshɔn we dɛn yuz na HIPS de mek i taf ɛn i de mek i nɔ krak, we de mek HIPS fayn fɔ trey we dɛn mek wit tɛm, aplayans layna, displei we dɛn print ɛn di kɔmpɔnɛnt dɛn we dɛn mek.
HIPS na kɔmɔn we dɛn kin pik usay wan prɔjek nid fɔ gɛt ikɔnomik kɔmbaynshɔn fɔ rigiditi, impak rɛsistɛns, tɛmofɔmabiliti, printabiliti ɛn izi fɔ mek we nɔ nid di ay pefɔmɛns lɛvɛl fɔ mɔ dia dia injinɛri plastic.
| Sɔntin | High Impact Polistayn Shit / HIPS Plastik Shit |
| Tin dɛn | Rɔba-Modifyed Polistayn / Ay Impɛkt Polistayn |
| Standart Tiknɛs Rɛnj | Na lɛk 0.2–6 mm |
| Tiknɛs dɛn we dɛn dɔn sho | 0.5 mm, 1.0 mm, 2.0 mm ɛn kɔstɔmayt gej dɛn |
| Standart Shit Sayz | 1220 × 2440 mm / lɛk 4 × 8 ft |
| Maksimal Kɔrɛnt Width | Aprɔksimatli 1600 mm fɔ di kɔrɛnt standad HIPS prodak famili |
| Kɔlɔ dɛn | Wait, blak, kala ɛn kɔstɔm kɔlɔ dɛn |
| Standart Sɔfays | Smɔl sɔfays; glos, tɛkstɔr ɔ aplikeshɔn-spɛsifi k sɔfays rikwaymɛnt dɛn fɔ kɔnfyus bay gred |
| Fɔm fɔ di Sapɔt | Flat sheet ɛn sɛlɛkɛt rolstɔk spɛsifikɛshɔn dɛn |
| Di we aw dɛn de du di wok | Tɛmofɔmin, vaykum fɔm, day kɔt, CNC kɔt, drɔlin, printin, peint ɛn lamin |
| Spɛshal Gret | Blak ESD / anti-statik HIPS de fɔ sɔm ilɛktronik pak aplikeshɔn dɛn |
| Men Aplikeshɔn dɛn | Pat dɛn we dɛn mek wit tɛmɔfɔm, frij layna, aplayans kɔmpɔnɛnt dɛn, pak trey, sayn, displei, print grafik ɛn ilɛktronik pak |
Gud Tɛmofɔmin Pɔfɔmɛnshɔn: Dɛn kin ɔt HIPS ɛn fɔm am to tre, layna, kɔva, haus ɛn ɔda tri-dimɛnshɔnal pat dɛn we yu de yuz di rayt tɛmfɔmin ikwipmɛnt.
Improved Toughness: Rɔba modifyeshɔn de gi big rɛsistɛns to impak ɛn krak pas standad GPPS.
Gud Printabiliti: Suitabl HIPS surfaces kin sɔpɔt skrin printin, dijital printin ɛn ɔda printin prɔses afta dɛn dɔn kɔnfyus kɔmpatibiliti ɛn surface-tritmɛnt rikwaymɛnt dɛn.
I izi fɔ mek: Dɛn kin kɔt HIPS, drɔl, rout, day-kɔt, lamin ɛn mek am insay kɔstɔmayt kɔmpɔnɛnt dɛn.
Gud Dimɛnshɔnal Stebiliti: HIPS de gi yusful balans fɔ rigiditi ɛn taf fɔ tre, sayn, layna ɛn panɛl dɛn we dɛn mek.
Kastom Kɔlɔ: Yu kin gi wayt, blak ɛn kɔstɔmayt kɔlɔ sheet dɛn akɔdin to wetin di prɔdak dizayn nid.
Kɔst-Ɛfɛktiv Prɔsesin: Bɔku pipul dɛn kin tink bɔt HIPS fɔ ay-volyum fɔm ɛn printin aplikeshɔn usay dɛn nid fɔ gɛt ikɔnomik tɛmplastik shit.
| Ficha | Standart HIPS | ESD / Anti-Statik HIPS |
|---|---|---|
| Men Fɔnkshɔn | Jɛnɛral impak-rɛsistant fɔm ɛn fabrikeshɔn | Fɔm plus aplikeshɔn-spɛsifi k statik-kɔntrol pefɔmɛns |
| Tiknes HSQY we de naw | Na lɛk 0.2–6 mm | aprכksimatli 0.2–1.8 mm pan di kכrant dεdikεt ESD prodak |
| Kɔlɔ | Wait, blak ɛn kɔstɔm kɔlɔ dɛn | Di HSQY dediket ESD prodakt naw na blak |
| Tipik Aplikeshɔn dɛn | Displei, layna, pak, thermoformed pat ɛn print panɛl | IC, PCB, PCBA, SMT ɛn ilɛktronik-kɔmpɔnɛnt trey ɔ protɛktiv pak |
| Ilektrikal Spɛsifikeshɔn | Nɔto nɔmal fɔ spɛsifa fɔ statik-kɔntrol aplikeshɔn dɛn | Target surface resistance ɛn test method fɔ kɔnfɔm bifo dɛn ɔda |
Anti-statik, statik-dissipativ ɛn kɔnduktiv nɔto wɔd dɛn we dɛn kin chenj. Di wan dɛn we de bay ilɛktronik-pak fɔ gi di ilɛktrik rɛsistɛns rɛnj we dɛn nid, tɛst prosidur ɛn savis ɛnvayrɔmɛnt we dɛn de aks fɔ ESD matirial.
Tɛmofɔmin na wan pan di impɔtant aplikeshɔn fɔ High Impact Polystyrene sheet.
We dɛn de du thermoforming, dɛn kin ɔt HIPS sheet te i bi sufayf pliable ɛn afta dat dɛn kin fɔm am agens wan mold we dɛn de yuz vaykum, prɛshɔn ɔ mɛkanikal ɛp.
Aplikeshɔn dɛn inklud aplayans layna, pak trey, displei kɔmpɔnɛnt, ɔtomotiv intɛriɔ pat, haus, kɔva ɛn ɔda fɔm kɔmpɔnɛnt dɛn.
Fɔ dip-dro pat, di wan dɛn we de bay fɔ gi di ɔrijinal shit tik, di kaviti dip, drɔ ratio, mold dimɛnshɔn ɛn di tin we dɛn nid fɔ dɔn di wɔl tik so dat dɛn go ebul fɔ evalyu di statin gej.
HIPS kin pik fכ vεkyum fכm biכs suitable gred kin prodyuz ditayl tri-dimεnshכnal kכmכpכnεnt dεm we de yuz rili strεt fכm prכsεs.
Vaykum-fɔmin pefɔmɛns fɔ evalyu yuz di aktual mold, ɔt sistɛm ɛn fɔm dip bikɔs if yu strɛch pasmak i kin ridyus di tik we di wɔl tik na kɔna ɛn dip kaviti.
Bifo mas prodakshɔn, tɛst pat difinishɔn, wɔl-tiknɛs distribyushɔn, shrinkage, trim, flatnɛs ɛn fayn impak pefɔmɛns.
HIPS kin gi wan smol say we yu kin print fɔ pɔynt-ɔf-pɔch displei, sayn, grafik panɛl, prɔmoshɔnal bod ɛn branded kɔmpɔnɛnt dɛn.
Dipen pan di printin sistem, di rayt gred dɛn kin sɔpɔt skrin printin, UV ɔ dijital printin ɛn ɔda kɔmɛshɔnal print prɔses dɛn.
Print pefɔmans dipen pan sɔfayz ɛnaji, sɔfa tritmɛnt, ink kemistri, we fɔ mɛn ɛn sɔfa finish. If dɛn nid fɔ trit korona ɔ wan spɛshal dayn lɛvɛl, put am insay di spɛsifikɛshɔn fɔ bay pas fɔ tek am se ɛvri HIPS gred gɛt di sem sɔfa tritmɛnt.
High Impact Polystyrene na tin we bɔku pipul dɛn kin tink bɔt fɔ frij intɛriɔ kɔmpɔnɛnt ɛn aplayans aplikeshɔn bikɔs i kin jɔyn rigiditi, fɔm kapabiliti, sɔfays apinans ɛn impak rɛsistɛns.
Di tin dɛn we pɔsin kin yuz na frij intɛriɔ layna, drɔwa kɔmpɔnɛnt, aplayans haus, kɔva ɛn thermoformed intɛriɔ panɛl.
Di aplayans projɛkt dɛn fɔ spɛsifa di opareshɔn tɛmpracha, ditarjen ɔ kemikal ɛksplɔshɔn, impak rikwaymɛnt, kɔlɔ, glos, fɔm dip ɛn ɛni aplikebul aplayans standad.
Tin HIPS shit kin thermoformed insay trey, insɛt, protɛktiv pak, kɔsmɛtik pak ɛn industrial kɔmpɔnɛnt pak.
Di wan dɛn we de bay pak fɔ difayn fɔm dip, pat rigiditi, impak rikwaymɛnt, stakabiliti, kɔlɔ ɛn ɛni it-kɔntakt, famasitik ɔ ilɛktronik-pakej rikwaymɛnt bifo dɛn pik wan gred.
HSQY in blak ESD HIPS prodak na fɔ thermoformed ilɛktronik pak lɛk IC trey, sɛmikɔndɔkta trey, PCB ɛn PCBA trey, FPC kyaria, SMT kɔmpɔnɛnt trey ɛn protɛktiv kɔmpɔnɛnt pak.
Di kɔrɛnt dediket ESD prodak de insay lɛk 0.2–1.8 mm tik ɛn dɛn kin saplae am insay kɔstɔmayz shit ɔ rol fɔmat.
Bikɔs thermoforming kin strɛch di matirial ɛn chenj lokal wɔl tik, ESD pefɔmɛns fɔ kɔnfɔm pan di finish fɔm trey we ilɛktrik rɛsistɛns impɔtant.
| Kɔlɔ | Tipik Sɛlɛkshɔn Dairekshɔn |
|---|---|
| Wait HIPS | Aplayans layna, printin, sayn, displei ɛn thermoformed prodak |
| Blak HIPS we dɛn kɔl | Indastrial kɔva, displei, fɔm prodak ɛn spɛshal ilɛktronik pak |
| HIPS we gɛt kɔlɔ | Ritayl displei, branded prodak, dekorativ pat ɛn prodak-spɛsifi k aplikeshɔn |
| Kastom Kɔlɔ | Yu kin tɔk bɔt aw fɔ mach di kɔlɔ bay we yu yuz fizik sampul, kɔlɔ rɛfrɛns ɔ we dɛn dɔn gri fɔ |
Di korekt HIPS tiknes dipen pan pat saiz, fom dip, rikwayd stiffness, impak rikwaym, printin proses en fabrication method.
| Tiknes Rɛnj | Jɛnɛral Sɛlɛkshɔn Dairekshɔn |
|---|---|
| 0,2–0,5 mm | Tin pak, ilɛktronik trey, insɛt ɛn laytwɛt tɛmɔfɔm aplikeshɔn dɛn |
| 0,5–1,0 mm | Pakɛj trey, print panɛl, displei ɛn laytwɛt fɔm kɔmpɔnɛnt dɛn |
| 1,0–2,0 mm | Big big pat dɛn we dɛn mek wit tɛm, di kɔmpɔnɛnt dɛn fɔ di aplayans, displei dɛn ɛn kɔva dɛn we de protɛkt dɛn |
| 2,0–4,0 mm | Mɔ rigid sayn dɛn, fɔm pat dɛn, layna dɛn ɛn industrial fabricated kɔmpɔnɛnt dɛn |
| 4,0–6,0 mm | Hevi-gej fɔm ɔ fabricated aplikeshɔn dɛn we nid fɔ gɛt mɔ stat-shit rigiditi |
Fɔ thermoforming, stat tiknes fɔ pik yuz di finish pat jɔyometri bikɔs dip drɔin kin rili ridyus lokal wɔl tik.
HSQY de saplae standad 1220 × 2440 mm HIPS shit , we dɛn kin kɔl lɛk 4 × 8 ft shit.
Dis fɔmat yusful fɔ distribyushɔn, sayn manifakta, tɛmɔfɔma ɛn fabricatɔ we de yuz standad shit-prɔsesin ikwipmɛnt.
Dɛn kin tɔk bak bɔt di kɔstɔm dimɛnshɔn ɛn wit we go rich lɛk 1600 mm akɔdin to di tik ɛn di tin dɛn we dɛn nid fɔ mek.
| Shit Ficha | HIPS | GPPS |
|---|---|---|
| Matirial Strukchɔ | Polistayn we dɛn dɔn chenj wit rɔba | Jɛnɛral-pɔpɔs polistayn |
| Aw a luk | Kɔmɔn fɔ mek i nɔ de shayn | Kɔmɔn fɔ transparent ɛn glos |
| Impekt Resistans fɔ mek yu nɔ gɛt ɛnitin fɔ du wit am | Higher bikɔs ɔf rɔba modifyeshɔn | Mɔ brittle |
| Di men tin we yu fɔ pik fɔ du | Tafnɛs, fɔm ɛn printin | Transparency, rigidity ɛn ikɔnomik klia shit |
| Tipik Aplikeshɔn dɛn | Trey dɛn we dɛn mek wit tɛmɔfɔm, displei dɛn, aplayans layna dɛn ɛn prɔdak dɛn we dɛn print | Klia displei, freym, transparent panɛl ɛn dɛkɔretiv aplikeshɔn dɛn |
Fɔ aplikeshɔn dɛn we nid klia jenɛral-pɔpɔs polistayn, rivyu wi GPPS Shit dɛn.
| Selekshɔn Faktɔ | HIPS | ABS |
|---|---|---|
| Tipik Pozishɔn | Ikonomik fɔm ɛn printin matirial fɔ midul-duti aplikeshɔn dɛn | Ɛnjinia tɛmplastik fɔ aplikeshɔn dɛn we nid difrɛn balans pan trɛnk, tafnɛs ɛn tɛmpracha pefɔmɛns |
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Widely yuz fɔ kɔst-ɛfɛktiv thermoformed prodak dɛm | Also kɔmɔn thermoformed fɔ mɔ dimand komponent dɛn |
| Fɔ print | Strɔng aplikeshɔn fit wit fayn print-grɛd sɔfays | Printin dipen pan ABS surface ɛn prɔsesin rikwaymɛnt |
| Tipik Disishɔn fɔ Pɔch | Pik we ikɔnomik fɔmabiliti ɛn printabiliti na prɔyorities | Evaluate wen di finish komponɛnt nid fɔ gɛt ay injinɛri pefɔmɛns |
Fɔ mɔ dimand injinɛri-plastik aplikeshɔn, kɔmpia di prɔjek rikwaymɛnt wit wi ABS Shit dɛn.
HIPS na tin we pɔsin kin du bɔku tin, bɔt dɛn nɔ fɔ trit am ɔtomɛtik wan lɛk injinɛri plastic fɔ ɛvri envayrɔmɛnt.
Standard HIPS gɛt limited lɔng tɛm UV rɛsistɛns. Di aplikeshɔn dɛn na do fɔ yuz wan aplikeshɔn-spɛsifi k UV-stabilized fɔmyulashɔn ɔ ɔda tin we nɔ de ambɔg di wɛda we dɛn de ɛkspɛkt fɔ de na di san fɔ lɔng tɛm.
HIPS nɔ fɔ jɔs pik bay di matirial nem fɔ aplikeshɔn dɛn we gɛt ɛlevɛt-tɛmpracha. Spɛsifik kɔntinyu ɛn pik tɛmpracha so dat dɛn go ebul fɔ evaluate di aktual gred.
Kεmikכl rεsistεns dipכnt pan di sכbstans, kכnsantreshכn, tεmprachכ εn strεs we dεn aplay to di kכmכpכnt we dεn dכn. Test di aktual klin, ɔyl, sɔlvɛnt ɔ prɔses kemikal bifo dɛn gi yu di las aprɔval.
Standard industrial HIPS nɔ fɔ ɔtomɛtik diskrayb as fud-kɔntakt kɔmpliant.
If dɛn go yuz HIPS fɔ pak it, frij fud-kɔntakt kɔmpɔnɛnt ɔ ɔda rigyulayt aplikeshɔn, gi di dɛstineshɔn makit, di kayn it, kɔntakt kɔndishɔn ɛn rigyuleshɔn we dɛn nid bifo yu pik di matirial.
Rigyuletɔri dɔkyumentri fɔ kɔnfyus fɔ di ɛksaktɔl saplai rɛsin fɔmyulashɔn, kɔlɔ ɛn gred.
Spɛsifik tɛm fɔm, vaykum fɔm, printin, frij layna, aplayans pat, pak, sayn, displei ɔ ilɛktronik pak.
Standard HIPS fayn fɔ jenɛral fɔm ɛn printin, we ilɛktronik pak kin nid fɔ gɛt difayn anti-statik, dissipativ ɔ kɔnduktiv gred.
HSQY naw de saplae standad HIPS insay aprכksimatli 0.2–6 mm. di pat dεm we dεn tεmכfכm fכ evaluate akɔdin to di fayn wכl tik εn drכ dip.
Standart 1220 × 2440 mm sheet dɛn de. Gi mashin wit, mold saiz ɔ rikwayd finish shit dimɛnshɔn fɔ kɔstɔmayz saplai.
Spɛsifik wayt, blak ɔ kɔstɔm kɔlɔ. Gi wan aprɔv fizik sampul ɔ rɛkɔgnayz kɔlɔ rɛfrɛns we dɛn nid fɔ klos kɔlɔ maching.
Gi di we aw dɛn de print, di ink sistem, di tritmɛnt we dɛn nid fɔ mek di say we dɛn de print ɛn di tin we dɛn nid fɔ mek di dayn usay i pɔsibul.
Gi fɔm dip, mold dimɛnshɔn, vaykum ɔ prɛshɔn fɔm prɔses ɛn rikwayd finish wɔl tik.
Spɛsifik yus insay ɔ na do, savis tɛmpracha, kemikal ɛksplɔshɔn ɛn mɛkanikal-impakt rikwaymɛnt dɛn.
If it kɔntakt, ilɛktroniks, flaym pefɔmɛns ɔ ɔda rigyuleshɔn rikwaymɛnt de aplay, no di rayt standad bifo yu gri fɔ di matirial.
Evaluate di matirial wit di aktual printin, fom, kot o asembli proses bifo yu apruv big customized oda.
HSQY de sɔpɔt kɔstɔmayz HIPS shit projɛkt fɔ tɛmɔfɔma, aplayans manifakta, pak kɔmni, printin kɔmni, sayn manifakta, ilɛktronik-pak saplay ɛn plastic distribyushɔn.
Di kɔstɔm opshɔn dɛn kin inklud:
Kastom tiknes insay fayn prodakshɔn rɛnj
1220 × 2440 mm standad sheet dɛn
Kastom sheet dimɛnshɔn dɛn
Widths up to approximately 1600 mm fɔ di standad prodak dɛm we de naw
Wait ɛn blak HIPS
Kastom kɔlɔ dɛn
Aplikeshɔn-spɛsifi k printin sɔfays dɛn
Tɛmofɔmin ɛn vaykum-fɔmin gred dɛn
Blak ESD HIPS sheet ɛn rol
Panɛl dɛn we dɛn kɔt to saiz
Day we de kɔt
CNC we dɛn de kɔt
Fɔ drɔl
Print ɛn laminating rikwaymɛnt dɛn
Kastom ɛkspɔt pakej
Impɔtant inspekshɔn ɛn aprɔval paramita dɛn kin inklud:
Sheet tik ɛn tolɛreshɔn
Wid ɛn lɔng tolɛreshɔn
Sheet we de flat
Di kɔnsistɛns we di kɔlɔ dɛn gɛt
Di we aw di wɔl de luk
Impekt pefɔmɛns usay dɛn spɛsifa am
Rigiditi we pɔsin kin gɛt
Tɛmofɔmin pefɔmɛns
Shrinkage afta fɔm usay i rili impɔtant
Print adhesion usay dɛn nid am
Surface tritmεnt usay dεn spεsifi k
ESD surface resistance usay dɛn nid am
Dimɛnshɔn dɛn fɔ kɔt ɛn fɔ mek tin dɛn
Pak ɛn palet kɔndishɔn
Dɛn kin pak HIPS sheet dɛn akɔdin to di sheet saiz, tik, sɔfa ɛn transpɔt we dɛn nid.
Protektiv rap, kraft pepa, PE film, katon ɔ palletized ɛkspɔt pak kin tɔk bɔt akɔdin to di kɔnfyus prodak spesifikeshɔn.
Fɔ rolstɔk ɔ tin-gej matirial, gi di rol wit we dɛn nid, di wet we di rol gɛt, di tin dɛn we dɛn nid fɔ du na di kɔr ɛn di tin dɛn we dɛn nid fɔ du fɔ mek di thermoforming-machine bifo dɛn prodyuz.
0.2–6 mm Standart Rεnj: HSQY in kכrant standad HIPS prodakt dεm de kכba tin-gεj fכm mεtirial dεm tru hεvi fabricated sheet dεm.
4 × 8 Shit Saplai: Standart 1220 × 2440 mm HIPS shit de fɔ distribyushɔn, tɛmɔfɔma, printa ɛn fabricatɔ.
Kastɔm Kɔlɔ dɛn: Wi kin tɔk bɔt wayt, blak, kɔlɔ ɛn prɔjek-spɛsifi k kɔlɔ we dɛn nid.
Tɛmofɔmin Aplikeshɔn: Dɛn kin pik matirial fɔ vaykum fɔm ɛn thermoforming akɔdin to tik, pat jɔyometri ɛn fɔm dip.
Printing Aplikeshɔn: Dɛn kin saplae HIPS fɔ sayn, grafik ɛn displei projɛkt usay printabiliti ɛn fabrication impɔtant.
ESD HIPS: HSQY de saplae blak ESD HIPS bak fɔ ilɛktronik pak projɛkt dɛn we nid difayn statik-kɔntrol pefɔmɛns.
Kastɔm Prɔsesin: Dɛn kin tɔk bɔt fɔ kɔt, day kɔt, CNC fabrication, printin ɛn ɔda prɔsesin rikwaymɛnt dɛn akɔdin to drɔin ɛn sɛmpul dɛn.
Material Alternatives: HSQY de saplae bak GPPS Shit fɔ transparent polistayn aplikeshɔn ɛn ABS Shit fɔ prɔjek dɛn we nid difrɛn injinɛri-pɔfɔmɛnshɔn balans.
| Aplay fɔm | Tɛmofɔmin, printin, frij layna, pak, sayn, displei, ilɛktroniks ɔ ɔda aplikeshɔn |
| HIPS Gret we yu de du | Standart, printin, fɔm, ESD ɔ rɛkɛmɔndeshɔn nid fɔ de |
| Tik we i tik | Tik ɛn tolɛreshɔn we dɛn nid |
| Sayz fɔ di Shit | 1220 × 2440 mm ɔ kɔstɔm wit × lɔng |
| Fɔm fɔ di Sapɔt | Flat sheet, kɔt sheet ɔ rollstock usay i de |
| Kɔlɔ | Wait, blak ɔ kɔstɔm kɔlɔ |
| Surface / Printin we yu de print | Printin prɔses, surface finish, korona tritmɛnt ɔ dayne rikwaymɛnt usay i apɔynt |
| Tɛmofɔmin we dɛn kin yuz fɔ mek tin dɛn | Fɔm dip, mold dimɛnshɔn, prɔses ɛn rikwayd finish wɔl tik |
| ESD Rikwaymɛnt | Target surface resistance, test method ɛn kondishɔn ɛnvayrɔmɛnt usay nid de |
| Rikwaymɛnt fɔ di Rigyuletɔri | Fɔd-kɔntakt, flaym, ilɛktroniks ɔ ɔda standad we dɛn kin yuz |
| Ɔmɔs | Trayal kwantiti, rɛgyula ɔda kwantiti ɛn ɛstimat ɛni ia dimand |
| Usay yu de go | Di kɔntri we dɛn de go ɛn di pɔt |
HIPS tinap fɔ Ay Impɛkt Polistayn. I na polistayn we dɛn dɔn modify wit rɔba faz fɔ mek i taf ɛn impɔk rɛsistɛns we yu kɔmpia am wit jenɛral-pɔpɔs polistayn.
Dɛn kin yuz HIPS sheet fɔ trey dɛn we dɛn mek wit tɛm, frij layna, aplayans pat, grafik dɛn we dɛn print, sayn, displei, pak, industrial kɔva ɛn spɛshal ilɛktronik pak.
Nɔ, HIPS na wan kayn polistayn we dɛn dɔn chenj wit rɔba we dɛn mek fɔ mek i taf mɔ. GPPS jεnarali na mכr rigid εn transparent bכt i de mכr brittle bak.
Dɛn kin pik HIPS fɔ impak resistans, thermoforming ɛn printin. GPPS na tin we dɛn kin pik fɔ transparent ɛn glos aplikeshɔn usay dɛn nid fɔ gɛt mɔ klia.
Bɔku tɛm dɛn kin pik HIPS fɔ ikɔnomik tɛmfɔmin ɛn printin aplikeshɔn dɛn, we dɛn kin ebul fɔ evaluate ABS we wan prɔjek nid difrɛn balans pan injinɛri trɛnk, tafnɛs ɛn tɛmpracha pefɔmɛns.
Yɛs. Tɛmofɔmin na wan pan di men aplikeshɔn fɔ HIPS. I kin fɔm to trey, layna, kɔva, haus ɛn bɔku ɔda tri-dimɛnshɔnal kɔmpɔnɛnt dɛn.
Yɛs. Suitabl HIPS gred kin bi vaykum fɔm. Wan prodakshɔn trayal fɔ verify mold difinishɔn, fayn wɔl tiknɛs, shrinkage ɛn finish-pat pefɔmɛns.
Yɛs. Dɛn kin yuz HIPS bɔku bɔku wan fɔ mek sayn dɛn ɛn fɔ mek grafik dɛn we dɛn print. Di kɔmpitishɔn fɔ print dipen pan di sɔfa, ink, di we aw dɛn de mɛn ɛn if dɛn nid fɔ gɛt korona ɔ ɔda tritmɛnt fɔ di say we dɛn de.
HSQY in kɔrɛnt standad HIPS prodak famili kɔba lɛk 0.2–6 mm, inklud fichu 0.5 mm, 1 mm ɛn 2 mm shit.
Yɛs. HSQY de saplae 1220 × 2440 mm HIPS shit, we dɛn kin tɔk bɔt as lɛk 4 × 8 ft.
Di standad HSQY HIPS prodak pej dɛn we de naw de list di wit dɛn we go rich lɛk 1600 mm. Kɔnfɛm maksimal waid we de fɔ di tik we yu nid bifo yu ɔda.
HSQY de saplae wayt, blak, kala ɛn kɔstɔm-kɔlɔ HIPS sheet dɛn.
Yɛs. HSQY naw de saplae wan blak ESD HIPS prodak in aprɔksimatli 0.2–1.8 mm tik fɔ sɔm sɛlɛkɛt ilɛktronik pak aplikeshɔn dɛn.
Nɔ. Anti-statik, statik-dissipativ ɛn kɔnduktiv matirial dɛn de tɔk bɔt difrɛn ilɛktrik-pɔfɔmɛnshɔn rɛnj dɛn. Spɛsifik di sɔfayz rɛsistɛns ɛn tɛst we yu nid bifo yu pik di matirial.
Yɛs. HSQY in kɔrɛnt ESD HIPS prodak na fɔ thermoformed ilɛktronik trey ɛn kɔmpɔnɛnt kyaria. Ilɛktrik pefɔmɛns fɔ tɛst bak afta dɛn dɔn fɔm.
Standard HIPS gɛt limited resistans to lɔng UV ɛksplɔshɔn. Di projɛkt dɛn we de na do fɔ sho wan fayn gred we UV-stabiliz ɔ fɔ evalyu ɔda plastic we nɔ de ambɔg di wɛda.
HIPS de gi yusful pefɔmɛns fɔ bɔku rum-tɛmpracha ɛn mɔdaret-tɛmpracha aplikeshɔn dɛn, bɔt dɛn nɔ fɔ trit am lɛk ay-tɛmpracha injinɛri plastic. Spɛsifik di ɔpreshɔn tɛmpracha we yu nid bifo yu pik wan gred.
HIPS na tin we dɛn kin tink bɔt fɔ frij intɛriɔ layna ɛn aplayans kɔmpɔnɛnt dɛn bikɔs ɔf in kɔmbayn fɔ fɔm pefɔmɛns, rigiditi ɛn tafnɛs. Di ɛksaktɔl aplayans spɛsifikɛshɔn fɔ stil validet.
Fɔd-kɔntakt suitability na gred-spɛsifi k. Nɔ tink se ɛvri industrial HIPS sheet fayn fɔ kɔntakt it. Kɔnfɛm di ɛksaktɔl fɔmyulashɔn ɛn di dɛstineshɔn-maket rigyuleshɔn we dɛn nid bifo yu ɔda.
Yɛs. Dɛn kin kɔt HIPS, CNC mashin, drɔ, day-kɔt ɛn mek am yuz fayn plastic-prosɛsin ikwipmɛnt.
Yɛs. Standart 1220 × 2440 mm sheet ɛn kɔstɔmayz dimɛnshɔn, tik, wit ɛn kɔlɔ dɛn kin tɔk bɔt akɔdin to di prɔjek rikwaymɛnt dɛn.
Wan sampul we dɔn de kin evalyu togɛda wit tik, kɔlɔ, sɔfa, fɔm, print ɛn pefɔmɛns rikwaymɛnt fɔ no wan aprɔpriet spɛsifikɛshɔn.
Dɛn kin tɔk bɔt di sampul dɛn we de fɔ evaluate tiknes, kɔlɔ, sɔfays, printin, thermoforming ɛn aplikeshɔn pefɔmɛns bifo dɛn ɔda bɔku bɔku wan.
Gi aplikeshɔn, tik, wit ɛn lɔng, kɔlɔ, shit ɔ rol rikwaymɛnt, printin ɔ fɔm prɔses, ESD rikwaymɛnt usay i apɔynt, kwantiti ɛn dɛstineshɔn.
Yu de luk fɔ wan rilibul HIPS shit manifakta , ay impak polistayn saplay ɔ kɔstɔm matirial fɔ tɛmfɔmin, vaykum fɔm, printin, aplayans ɔ ilɛktronik-pak aplikeshɔn?
Send HSQY yu tiknes we yu nid, sheet dimɛnshɔn, kɔlɔ, fɔm ɔ printin prɔses ɛn ɛstimat kwantiti we yu bay. Fɔ ESD pak, inklud di sɔfayz rɛsistɛns ɛn tɛst we dɛn nid so dat dɛn go ebul fɔ evaluate di fayn matirial.
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